Hi all, In a test, I find there are large ringings on some DDR control signals occasionally. According to the timing diagram, I suspect SSN leads to the large ringing. And the spice simulation result which I imitate SSN mechanism looks like the test waveforms. I think there is a resonance generated by C_die and package parasitics (L_pkg dominantly). I derive the resonance frequency from the ringing period and add several corresponding decaps near the chip for improving the PDN. It seems these decaps hardly have effect on SSN. Since the L_pkg is usually about 10nH if the package is bad designed, it almost separate the effect of PDN on die side from board decaps on mega Hz, can the resonance be improved by board caps? Appreciate any idea that those have experience on SSN and PDN co-design could share. Best Regards, Zhengrong ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List technical documents are available at: http://www.si-list.net List archives are viewable at: //www.freelists.org/archives/si-list or at our remote archives: http://groups.yahoo.com/group/si-list/messages Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu