[SI-LIST] Call For Papers: EPEP 2004

From: Raymond Anderson <Raymond.Anderson@xxxxxxx>
To: si-list@xxxxxxxxxxxxx
Date: Tue, 17 Feb 2004 14:20:13 -0800
(Please respond to the contacts given at http://www.epep.org/ and not
the poster of this message.)
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*13th Topical Meeting on Electrical Performance of Electronic Packaging
EPEP 2004*
October 25-27, 2004
Portland, Oregon

Sponsors

The IEEE Components, Packaging and Manufacturing Technology Society
The IEEE Microwave Theory and Techniques Society

*Call for Papers*
The general subject of the meeting is the electrical modeling, design, 
analysis, and characterization
of electronic interconnections and packaging structures. Authors are invited to 
submit papers 
describing new technical contributions in the areas broadly covered below:

* Current and future issues related to on-chip interconnections
* Router friendly models and modeling tools: accuracy & efficiency
* Modeling and design of high speed digital IO circuits: signal propagation and 
reception
* On-chip power delivery and regulation
* Advances in modeling core switching noise, and design of novel solutions
* On-chip measurement techniques
* Package analysis, including numerical methods
* Electromagnetic analysis tools
* Advances in transmission-line techniques
* Power distribution and package resonance
* Long distance propagation in large switching complexes
* Switching noise in multi-layered systems
* Optoelectronic packaging; structure and system applications

* Electrical issues in MEMS packaging
* New and innovative interconnect packaging structures and their electrical 
performance
* RF/microwave packaging structures and their electrical performance
* MMIC modules and high density packaging
* Experimental characterization techniques 
* EMC/EMI sources & effects
* Prediction/measurement of radiation from on-chip sources, interconnect 
structures and packages 
* Electrical design implications for low cost, high volume packaging
* Packaging concerns for wireless communication: design and modeling
* Packaging solutions for one chip radios: design and modeling
* Performance of packaging for automotive radar systems
* 
Conference  Co-chairs:  Tawfik Arabi, Intel Corp.;   Robert W. Jackson, 
University of Massachusetts 
Conference Web Page:  *Detailed and updated information can be found at 
http://www.epep.org*
Paper Submission:    Detailed information for authors can be found on the 
conference web page. 
Electronic submissions of no more than four pages must be received no later 
than July 10, 2004.  
Student Paper Award: Two awards will be presented to the best two papers 
submitted by students 
Short Courses/Workshops:  On Sunday, October 24, 2004, a workshop entitled 
"Future Directions 
in Packaging" will be presented and short courses/tutorials will be offered. 




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[SI-LIST] Call For Papers: EPEP 2004

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