[SI-LIST] Boston area mtg, thermal management on PCBs
- From: Jeff Seeger <jseeger@xxxxxxxxxxxxxx>
- To: si-list@xxxxxxxxxxxxx
- Date: Fri, 09 Feb 2007 16:02:38 -0500
,
(With apologies to those out of the area, I hesitated on posting
this here but many who deal with SI also have concerns with heat)
Thermal Management on PCBs
The Greater Boston Chapter of the IPC Designer's Council is
holding its next meeting on Thursday, Feb 15th at 6pm in the
conference room at iRobot in Burlington MA.
Brad Saunders, of Selmark, will present on the implications
of Thermal Management on PC Boards. This topic will discuss
choosing methods ie conduction versus convection, and impact
of using heavy copper. Other common ways to facilitate the
movement of thermal energy will be covered, such as the use
of thermal grease or Sil-Pads, and thermally conductive lam-
inates. Compatibility of various methods with product goals
must be reviewed carefully, as choices desired for carrying
heat (or power) often must be compromised in the presence of
fine geometry components.
Mr Saunders is Military Markets Manager for Selmark, a New
England Region manufacturer's rep firm. While new to this
position, he has held numerous key roles in all aspects of
the PWB industry, including commercial and military orien-
tations on both sides of the vendor/oem table.
Agenda:
6:00 pm, Arrivals/Pizza, $5 meeting fee
6:30 Jeff Seeger - Chapter Update
6:45 Brad Saunders, Thermal Management
Location:
iRobot, 63 South Ave, Burlington MA. Directly across from
the Burlington Mall just off of Middlesex Turnpike; South
Ave has Long's Jeweler's on the corner. As you proceed up
South Ave, iRobot's front door is at the first left.
RSVP's needed:
Please RSVP to Jeff Seeger jseeger@xxxxxxxxxxxxxx , if you
are bounced by a spam blocker please rsvp to Janice Lund
jlund@xxxxxxxxxx by Thursday noon, 15-Jan. We need this
in order to plan the refreshments.
President's Note:
As performance increases, so do power and therefore heat.
Managing these along with the densities of modern parts is
only becoming more intricate. Heatsink in air, or thermal
plane? Multiple plane layers, or heavier copper? How to
use thermal vias in a heat slug or with a .8mm pitch BGA?
How do you heatsink to a chassis ground without tying your
system ground to it? How much power or heat can we really
count on handling? We face these tradeoffs every day. Is
there a better way?
We are looking forward to bringing further timely and en-
gaging topics, including Regulatory Compliance, RoHS, and
the demands placed on boards by ever-finer geometries.
Mission:
The physical design of circuit boards is only getting more
complex. Only the physical designer can hope to sort out
the myriad interests that add up to a printed circuit board.
The Greater Boston Chapter of the IPC Designer's Council
is trying to bring the stake holders from every discipline,
to show you their problems and solutions so you can add to
your arsenal of knowledge.
Your help and participation would be most appreciated, how
about getting involved!
Thanks and regards,
Jeff Seeger, CTO, Applied CAD Knowledge Inc.
President, Greater Boston Chapter, IPC Designer's Council
------------------------------------------------------------------
To unsubscribe from si-list:
si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field
or to administer your membership from a web page, go to:
//www.freelists.org/webpage/si-list
For help:
si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field
List technical documents are available at:
http://www.si-list.net
List archives are viewable at:
//www.freelists.org/archives/si-list
or at our remote archives:
http://groups.yahoo.com/group/si-list/messages
Old (prior to June 6, 2001) list archives are viewable at:
http://www.qsl.net/wb6tpu
Other related posts:
- » [SI-LIST] Boston area mtg, thermal management on PCBs
