[SI-LIST] BGA Vs QFP
- From: Canes Venatici <starsilic@xxxxxxxxx>
- To: si-list@xxxxxxxxxxxxx
- Date: Mon, 23 Apr 2007 06:39:53 -0700 (PDT)
Hi all,
I'm having some confusion related to BGA. I believe BGA can have planes for
ground, core vdd, io vdd etc.
Since the planes are equipotential, can I assume for same number of power pin
count in QFP, I can reduce balls in BGA.
For ex.,
I have a common die for two packages say, QFP and BGA with same number of pads
for both packages.
But I want to reduce the power pin count by taking advantage of planes in BGA.
Is it possible?
Could anyone throw some light on it?
Regards
Canes
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