there have been many discussions on the list about the coupling, thus I don't want to summarize all of them. For your special case I see a potential issue in close coupling as it is on the outer layer. Outer layer aren't preferred for impedance controlled traces as (among other reasons) the copper thickness added during thru hole plating is hard to control. This leads to etching variations. With such close coupling as you propose (3-4 mil) you will see strong impedance variations ( I would expect the gap to vary at least from 3 to 5 mil). Ask your PCB vendor about the etch tolerances for your layout and stack, and then do a quick cornercase simulation. BR Gert -------------------------------------------------------------------------- Absender ist HARTING Electronics GmbH & Co. KG; Sitz der Gesellschaft: Espelkamp; Registergericht: Bad Oeynhausen; Register-Nr.: HRA 5596; persönlich haftende Gesellschafterin: HARTING Electronics Management GmbH; Sitz der Komplementär-GmbH: Espelkamp; Registergericht der Komplementär-GmbH: Bad Oeynhausen; Register-Nr. der Komplementär-GmbH: HRB 8808; Geschäftsführer: Edgar-Peter Duening, Torsten Ratzmann, Dr. Alexander Rost -----Ursprüngliche Nachricht----- Von: si-list-bounce@xxxxxxxxxxxxx [mailto:si-list-bounce@xxxxxxxxxxxxx] Im Auftrag von Dong Kim Gesendet: Mittwoch, 12. Januar 2011 19:44 An: si-list@xxxxxxxxxxxxx Betreff: [SI-LIST] PCIe3 trace width(8mil) and edge distance(3 to 4 mil) between + and - of differential pairs? Hi, I have 8 lane differential PCIe3 (8Gbps) signals to be routed between a BGA component and PCIe3 edge connector on a some FR4 material board. The distance between the ball and the edge connector pin is about 2 inches. No via on the top layer RX pairs and one via with 0402 capacitors on the bottom layer TX pairs. I am using 8 mil traces width with matching 100 ohm differential impedance at the receiver chip for 50ohm board impedance. The distance between the edges of the "+" signal and "-" signal is 3 to 4 mil. It is close coupling. I expect there will be some mutual coupling between the edges. In my past projects with high speed differential signals, I always used loose coupling between + and - signals of a differential pair. I am curious of the potential issues by using close coupling between the + and - of the pairs. The reason for close coupling is not for the concern of the potential EMI issue. I understand board level high speed differential signals does not have EMI issues like actual transmission cables running up on the air. If you see a potential issue for close coupling, please let me know. Simulation will be performed. But, in my opinion, simulation is only as good as the tool and the parameter can go. I thouught it would be good idea to get some theoretical concept bounced around. Thanks, Dong S. Kim ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List technical documents are available at: http://www.si-list.net List archives are viewable at: //www.freelists.org/archives/si-list Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List technical documents are available at: http://www.si-list.net List archives are viewable at: //www.freelists.org/archives/si-list Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu