(I forgot to change the subject line of Sue's post to the appropriate topic, so I'm doing that this time). Technically, a device, usually metal, that draws heat away from either a heat-sensitive device and/or a device that produces large amounts of heat, to facilitate faster more efficient cooling of the hot device. In this context, it's a HSF unit (heatsink & fan) which MUST go on the motherboard's CPU (aka processor), or the CPU will melt (or, theoretically they are supposed to shut down via thermal protection before it melts). There are usually HS's all over a motherboard, and video card. Some of them will have fans on the HS if the HS is too small or if the device gets too hot for a HS alone. Years ago, you never saw any HS's on a mobo (aka motherboard), and the CPU only needed a HS and not even a fan. But the faster the chips operate, the hotter they get, therefore the need for HS's, and larger and larger ones. It order for a HS to work properly, it's surface ideally should be mirror-smooth, as should the surface of the HS, and tightly and squarely attached at perfect right angles to each other. If there are any surface imperfections, the more of them that exists the worse the HS will perform and the hotter the device will get. If they are smooth enough down to the atomic-level, no TIM (thermal interface material) is needed. But since the two surfaces can never be like that in practical use, even after lapping, hence the requirement of good TIM. ("Lapping" is a multi-stepped VERY fine sanding process on both CPU and HS surfaces in efforts to achieve these perfect mirror-smooth surfaces). Ideally, TIM fills all the surface imperfections, creating a greater contact area for better cooling. The greater the contact area, the better the cooling. TIM can be silicone based (not very good), or have copper or silver particles in it, or PCM (phase-change material), or thermal pads. There's a huge market of TIM, dozens and dozens of various patented formulas, with more coming out each year. Lapping can't really be done on non-metallic chips, like transistors, FET's (Field Effect Transistors) or IC's (Integrated circuit chips) because they are usually silicon or similar material (that can operate a high temps), and you can't exactly sand those. With those that require a HS, you usually need more TIM to cover the greater surface imperfections. To much TIM can actually be a thermal INSULATOR, which of course is bad. So you always want to use as little as possible. -Clint God Bless, Clint Hamilton, Owner www.OrpheusComputing.com www.ComputersCustomBuilt.com www.OrpheusComputing.com/PCworks-computer-help-email-list.html ----- Original Message ----- From: "Sue Cubic" At 10:05 AM 4/3/2009 -0500, you wrote: >There was a time when I didn't know the difference between a >hard drive (HDD) and a floppy drive (FDD), and didn't know >that >a CPU needed a heatsink! Ok, Clint. I'll bite. What's a heatsink? Sue (computing since 1986, and never knew I needed one!) ========================= The list's FAQ's can be seen by sending an email to PCWorks-request@xxxxxxxxxxxxx with FAQ in the subject line. To unsubscribe, subscribe, set Digest or Vacation to on or off, go to //www.freelists.org/list/pcworks . You can also send an email to PCWorks-request@xxxxxxxxxxxxx with Unsubscribe in the subject line. Your member list settings can be found at //www.freelists.org/cgi-bin/lsg2.cgi/l=pcworks . Once logged in, you have access to numerous other email options. The list archives are located at //www.freelists.org/archives/pcworks/ . All email posted to the list will be placed there in the event anyone needs to look for previous posts. -zxdjhu-