Hi all, I recently had this response from my fabrication house, and was wondering if anyone else has run into this issue. I'm still trying to figure out exactly what it means (e.g. costs me). ---------------------------- Due to blind vias/epoxy fill requirement & spacing on the outer layers, a new copper wrap plating process cannot be achieved per IPC 6012B due to spacing issues. I would like to verify if we can wave this process since you have less than 4 mils space on your data. Please see below. In mid January of 2007, IPC released Amendment 1 of 6012B, updating it's copper wrap plating spec (3.6.2.11.1) that reads as follows: Copper wrap plating minimum as specified in Table 3-2 shall be continuous from the filled plated hole onto the external surface of any plated structure and extend by a minimum of 25 um (984uin) where an annular ring is required. Reduction of wrap-plating by processing (sanding, etching, planerization, etc.) resulting in insufficient wrap plating is not allowed. XXX1 is committed to manufacturing your PCB's to the highest standards. Due to the panelizing process, designs requiring a space of 4 mils or smaller can not be built to this spec. ---------------------------- Thanks in advance. Mitch ----------------------------------------- Stay ahead of the information curve. Receive PCB news and jobs on your desktop daily. Subscribe today to the PCB CafeNews newsletter. [ http://www10.pcbcafe.com/nl/newsletter_subscribe.php ] It's informative and essential. This message was sent to you from a machine at 192.35.156.11 ----------------------------------------------------------- To subscribe/unsubscribe: Send a message to icu-pcb-forum-request@xxxxxxxxxxxxx with a subject of subscribe or unsubscribe To view the archives of this list go to //www.freelists.org/archives/icu-pcb-forum/ Problems or Questions: Send an email to icu-pcb-forum-admins@xxxxxxxxxxxxx -----------------------------------------------------------