[PCB_FORUM] Re: Thermal Pad vias-to-gnd plugged?

  • From: Dave Seymour <dseymour@xxxxxxxxxxx>
  • To: "icu-pcb-forum@xxxxxxxxxxxxx" <icu-pcb-forum@xxxxxxxxxxxxx>
  • Date: Thu, 26 Jan 2012 15:21:28 +0000

Yeah, that then moves into the area of "stuff" being trapped in the "cup" of a 
via with a cap.

Thanks
Dave


Dave Seymour
Ixia
www.ixiacom.com<http://www.ixiacom.com>
919.267.4840

From: icu-pcb-forum-bounce@xxxxxxxxxxxxx 
[mailto:icu-pcb-forum-bounce@xxxxxxxxxxxxx] On Behalf Of Ritter, Alan
Sent: Thursday, January 26, 2012 10:18 AM
To: icu-pcb-forum@xxxxxxxxxxxxx
Subject: [PCB_FORUM] Re: Thermal Pad vias-to-gnd plugged?

Per the Cypress layout recommendation, vias are tented/capped on the top only.  
They're open on the bottom.  Shouldn't be a problem with the caps popping off 
since they're under the thermal pad on the IC.

Alan Ritter
Surgical Equipment Design & Development
Engineering Fellow

(636) 226-3364 (Office)
(636) 226-3552 (FAX)
(314) 488-1139 (Mobile)

Bausch + Lomb
3365 Treecourt Ind. Blvd.
St. Louis, MO  63122
www.bausch.com<http://www.bausch.com/>
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