[PCB_FORUM] Re: Thermal Pad vias-to-gnd plugged?

  • From: "Ritter, Alan" <Alan.Ritter@xxxxxxxxxx>
  • To: "icu-pcb-forum@xxxxxxxxxxxxx" <icu-pcb-forum@xxxxxxxxxxxxx>
  • Date: Thu, 26 Jan 2012 10:17:58 -0500

Per the Cypress layout recommendation, vias are tented/capped on the top only.  
They're open on the bottom.  Shouldn't be a problem with the caps popping off 
since they're under the thermal pad on the IC.

Alan Ritter
Surgical Equipment Design & Development
Engineering Fellow

(636) 226-3364 (Office)
(636) 226-3552 (FAX)
(314) 488-1139 (Mobile)

Bausch + Lomb
3365 Treecourt Ind. Blvd.
St. Louis, MO  63122
www.bausch.com<http://www.bausch.com/>
[cid:image001.png@01CCDC0B.64D603C0]




PRIVILEGE AND CONFIDENTIALITY NOTICE: The information contained in and/or 
attached to this e-mail message is intended solely for the use of the addressee 
and may contain information that is legally privileged, confidential or exempt 
from disclosure.  If you think you received this message in error, please 
notify the sender immediately by replying to the email and then delete it from 
your computer.  Do not disclose the contents to anyone.  Thank you.

PNG image

Other related posts:

  1. Home
  2. icu-pcb-forum
  3. Archive
  4. 01-2012