[PCB_FORUM] Re: Thermal Pad vias-to-gnd plugged?

  • From: "Ritter, Alan" <Alan.Ritter@xxxxxxxxxx>
  • To: "icu-pcb-forum@xxxxxxxxxxxxx" <icu-pcb-forum@xxxxxxxxxxxxx>
  • Date: Thu, 26 Jan 2012 10:17:58 -0500

Per the Cypress layout recommendation, vias are tented/capped on the top only.  
They're open on the bottom.  Shouldn't be a problem with the caps popping off 
since they're under the thermal pad on the IC.

Alan Ritter
Surgical Equipment Design & Development
Engineering Fellow

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