[ibis-macro] Questions on On-Die Interconnect
- From: "Walter Katz" <wkatz@xxxxxxxxxx>
- To: "Ibis-Interconn" <ibis-interconn@xxxxxxxxxxxxx>, "IBIS-ATM" <ibis-macro@xxxxxxxxxxxxx>
- Date: Sun, 16 Sep 2012 08:22:03 -0400 (EDT)
All,
We have had input from several IC Vendors on packaging requirements,
however, we have had no input from IC Vendors on On-Die interconnect
requirements. Here is a specific set of questions that need to be
answered. These questions specifically address chips where the IC Vendor
currently has on-die interconnect models that they either deliver or would
like to deliver to their System Company customers.
1. Does there exist any chip where the on-die interconnect models
are different for all channels that use the same [Model]?
2. Does there exist any chip where there are on-die interconnect
models with cross talk between channels?
3. Does there exist any chip where there are on-die interconnect
models with cross talk between channels and supply voltages?
4. Does there exist any chip where there are on-die interconnect
models with multiple die pads nodes for each supply voltage?
5. Does there exist any chip where there are on-die interconnect
models with multiple buffer pads nodes for each supply voltage?
6. Does there exist any chip where the on-die interconnect models
for a channel are other than s2p or s4p Touchstone files?
If the answer to any of these questions is Yes, does the IC Vendor use
them just internally or deliver these models to System Companies with no
NDA?; with an NDA?
If the answer to all of these questions is No, does the IC Vendor have
plans to deliver such models to System Companies in the future, and if so
when?
Walter
Walter Katz
<mailto:wkatz@xxxxxxxxxx> wkatz@xxxxxxxxxx
Phone 303.449-2308
Mobile 303.335-6156
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