All, At the next IBIS-ATM I would like to answer any questions about the presentation I gave today. Posted at: http://tinyurl.com/cvykehz or the full URL: http://www.eda.org/pub/ibis/macromodel_wip/archive/20120806/walterkatz/IBI S-ISS%20Package%20Modeling/IBIS_ISS_Package_Modeling_120807.pdf If you do have any questions, please either e-mail to this reflector or me directly. More importantly, questions to the IC Vendor members: 1. Does the functionality described in this presentation satisfy your needs to generate package and on-die models using that your customers require? 2. If not, what additional functionality do you need? 3. Please e-mail answers to question 2 to this reflector or me directly in advance of the next IBIS-ATM meeting. Finally, we need to decide whether to pursue this methodology, or use the methodology describes in BIRDs 125 and 145: http://www.vhdl.org/pub/ibis/macromodel_wip/archive/20120724/arpadmuranyi/ Package%20Modeling%20in%20IBIS/PackageModeling_with_BIRD125_145.pdf Make IBIS-ISS Available for IBIS Package Modeling <http://www.eda.org/ibis/birds/bird125.1.txt> Cascading IBIS I/O buffers with [External Circuit]s using the [Model Call] keyword <http://www.eda.org/ibis/birds/bird145.2.txt> Walter Walter Katz <mailto:wkatz@xxxxxxxxxx> wkatz@xxxxxxxxxx Phone 303.449-2308 Mobile 303.335-6156