Walter,
Thanks! These changes should be fairly easy to make.
- MM
From: ibis-interconn-bounce@xxxxxxxxxxxxx
[mailto:ibis-interconn-bounce@xxxxxxxxxxxxx] On Behalf Of Walter Katz
Sent: Wednesday, January 25, 2017 2:23 PM
To: IBIS-Interconnect <ibis-interconn@xxxxxxxxxxxxx>
Subject: [ibis-interconn] Re: IBIS Interconnect Task Group: Status and
Proposal Overview
MM,
Significant suggestions for Slide 5 and 8
Walter
Slide 5
* Any useful interconnect improvement proposal must support.
- Coupled and uncoupled I/O models
- POWER and GND models
- Coupled I/O and POWER and GND models
- Clear identification of aggressors and victims in coupled sims
- IBIS-ISS and Touchstone models
- Models can be from pin to buffer or can be split into package and
on-die interconnect
- Connections without requiring legacy package keywords
- Explicit identification of interconnect terminals by pin_name,
signal_name or even [Pin Mapping] bus_label
Slide 8 split into two slides
Interconnect Models and Model Sets
Designed to Support the Way Package
and On-Die Interconnect Models are
Generated and Delivered Today
- Identify whether a coupled signal is only an aggressor or also
"experiences" coupling from all other sources
Slide 8a
* Interconnect Model Sets
- Any Grouping Interconnect Models
- Can have separate Interconnect Model Sets for different interfaces
* DDR Memory subsystem
* PCEi Bus
* Power
- Can have separate Interconnect Model Sets for coupled simulations
- Can have separate POWER and GND Interconnect Model Sets
* Simple POWER and GND with each POWER and GND signal names lumped into a
single terminal at the Pins and on the Silicon
* Detailed POWER and GND with a terminal for each POWER and GND pin, and
POWER and GND rail connection at each I/O buffer.
* Middle ground where groups of pins (bus_labels) are connected to a single
terminal.
Walter
From: ibis-interconn-bounce@xxxxxxxxxxxxx
<mailto:ibis-interconn-bounce@xxxxxxxxxxxxx>
[mailto:ibis-interconn-bounce@xxxxxxxxxxxxx] On Behalf Of Mirmak, Michael
Sent: Wednesday, January 25, 2017 4:56 PM
To: IBIS-Interconnect (ibis-interconn@xxxxxxxxxxxxx
<mailto:ibis-interconn@xxxxxxxxxxxxx> ) <ibis-interconn@xxxxxxxxxxxxx
<mailto:ibis-interconn@xxxxxxxxxxxxx> >
Subject: [ibis-interconn] IBIS Interconnect Task Group: Status and Proposal
Overview
(apologies if you receive this twice)
Please find enclosed an updated presentation, "IBIS Interconnect Task Group:
Status and Proposal Overview" for the IBIS Summit at DesignCon, with changes
from today's task group meeting review. Additional comments and suggestions
are welcome.
- MM
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