[SI-LIST] thermal relief
- From: jan gillis <jan.gillis@xxxxxxxxxxxxxx>
- To: si-list@xxxxxxxxxxxxx
- Date: Wed, 28 Apr 2004 13:09:00 +0200
Hi all,
I am designing a four-layer microwave synthesizer. The second layer is
defined as a ground plane. For soldering purposes, it would be preferred to
make use of thermal reliefs for the ground vias. But I wonder what would be
the influence of the pin-to-ground plane impedance. Can anyone provide some
guideline for this purpose?
Thanks!
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