[SI-LIST] Re: si-list Digest V4 #261
- From: Geoff Stokes <gstokes@xxxxxxxxx>
- To: si-list@xxxxxxxxxxxxx
- Date: Fri, 2 Jul 2004 10:23:45 +0100
I think this is helpful but might not be a complete discussion. It seems to
assume that the wave modes on the connecting copper microstrips or
striplines are well-characterised. The de-embedding normally uses the
simplest wave mode. This will often not be representative, particularly in
a dense board layout situation. I'm not exactly sure how to address it, but
I have noticed that the current flow around the via is quite complicated.
The impedance is quite sensitive to via position. Ideally, rather than a
single via, the vias should be closely repeated in a region. In some RF
applications, to get much lower effective inductance on a ground connection,
instead of a row of vias, the board is milled with a slot before plating.
Again, the positioning of the slot will be critical.
> -----Original Message-----
> From: Ivan Ndip [mailto:ndip@xxxxxxxxxxxxxxxxx]
> Sent: 01 July 2004 10:18
> To: kpalusa@xxxxxxxxx; si-list@xxxxxxxxxxxxx
> Subject: [SI-LIST] Re: si-list Digest V4 #261
>=20
>=20
> Hi,
> you have to first develop an EM model of the via, together with the=20
> planes in HFSS. Use feeding lines to connect the via to the=20
> wave ports.=20
> Assign materials to the model, define the ports and set up the=20
> convergence criteria (e.g., maximum delta_S). At the end of the field=20
> simulation, remove the effects of the feeding lines through=20
> de-embedding. You can now use the resulting S-parameters to=20
> extract the=20
> electrical parameters (e.g., inductance, capacitance,...) of the via.=20
> One way of doing this is to use a circuit simulator (e.g.,=20
> Serenade from=20
> Ansoft, ADS,...). Based on the extracted S-parameters, develop and=20
> equivalent circuit model of the via and through optimization, these=20
> electrical parameters can then be obtained.
>=20
> Best regards,
> Ivan Ndip
>=20
>=20
> kusuma palusa wrote:
>=20
> >Hello,
> >=20
> >Can somebody please suggest how to extract inductance of a=20
> through via from HFSS
> >=20
> >Thanks
> >
> > =09
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> --=20
> **************************************************************
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> Dipl.-Ing. Ivan N. Ndip
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