Content-Type: text/plain; charset="us-ascii" Content-Transfer-Encoding: quoted-printable =20 Hello all =20 Can someone help me with routing issue of diff pair at 10gig from serdes chip to XFP connector=20 I have 2 options -=20 1. Rout in outer layer (cs) without vias with solder mask cover reference plane in layer 2 (the traces will go under the xfp cage would it be a problem) 2. Rout it in inner layer in strip line between to planes but with 2 vias per line=20 =20 What should work best for me =20 thanks ________________________________ Moshe Frid=20 Senior PCB Designer=20 Adcom Computers and Communications Ltd. 17 Ha'Tidhar st., Ra'anana Israel 43665 Tel: +(972)-9-7417411 ext. 108 Fax: +(972)-9-7417422 Mobile: +(972)-54-6573232 E-mail: moshef@xxxxxxxxxxx <http://www.adcom.co.il>=20 =20 =20 -- Binary/unsupported file stripped by Ecartis -- -- Type: image/jpeg -- File: image001.jpg -- Desc: image001.jpg ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List technical documents are available at: http://www.si-list.net List archives are viewable at: //www.freelists.org/archives/si-list or at our remote archives: http://groups.yahoo.com/group/si-list/messages Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu