[SI-LIST] Re: What is the acceptable minimum pre-pregthickness for volume manufacturing?
- From: B Simonovich <b_simono1@xxxxxxxx>
- To: si-list@xxxxxxxxxxxxx
- Date: Tue, 5 Sep 2006 11:19:14 -0700 (PDT)
The Sanmena-SCI licencing for burried capacitance is for ZBC-2000(TM)
laminates. This laminate is a specially constructed copper cladded FR4 core
with a single ply of 106 or 6060 style pre-preg having a dielectric thickness
of 0.002 inches (+/- 0.0005 inches) after cross-sectioning. The drum side
(smooth side) of the copper foil contacts the prepreg while the rough matte
surface is exposed. Depending on the actual prepreg used, the distributed
capacitance is approx 500pf to 550pf/sq inch. It is treated like any other core
within a PCB stackup and is compatible with the normal PCB fabrication process.
Using ZBC200(TM) material allows you to pass Bell Core GR-78-CORE with
exception clause. Specifying dielectric less than 0.004" without using
ZBC200(TM) laminate or equivalent means you need to do the work to have the
exemption if it matters to you.
Regards,
Bert Simonovich
-----Original Message-----
From: si-list-bounce@xxxxxxxxxxxxx [mailto:si-list-bounce@xxxxxxxxxxxxx] On
Behalf Of Lee Ritchey
Sent: Tuesday, September 05, 2006 12:09 PM
To: Steve Weir; John Andresakis; Gilles Aminot; si-list@xxxxxxxxxxxxx
Subject: [SI-LIST] Re: What is the acceptable minimum pre-pregthickness for
volume manufacturing?
Steve,
Good eye! Somehow, I typed the wrong date in my reference library index.
That is the article.
It is curious that thousands of PCBs have been designed with planes separated
by thin dielectrics for the purpose of forming planae capacitance without any
of them being challenged as violating these patents.
Lee
> [Original Message]
> From: steve weir <weirsi@xxxxxxxxxx>
> To: <leeritchey@xxxxxxxxxxxxx>; Andresakis, John
<John.Andresakis@xxxxxxxxxxxxx>; Gilles Aminot <aminotg@xxxxxxx>;
si-list@xxxxxxxxxxxxx <si-list@xxxxxxxxxxxxx>
> Date: 9/4/2006 11:39:51 PM
> Subject: [SI-LIST] Re: What is the acceptable minimum
> pre-pregthickness
for volume manufacturing?
>
> Lee, did you mean August 2004? Joel's piece can be found on the 3M
> web
site.
>
>
http://multimedia.mmm.com/mws/mediawebserver.dyn?6666660Zjcf6lVs6EVs66S73jCO
rrrrQ-#search=%22%22printed%20circuit%20design%22%20%2B%22the%20history%20of
%20embedded%22%22
>
> Regards,
>
>
> Steve.
> At 11:34 AM 9/4/2006, Lee Ritchey wrote:
> >There was an article in the August 03 issue of Printed Circuit Design
> >magazine titled "The History of Embedded Distributed Capacitance," by
Jole
> >Pfeiffer of 3M showing that the patents held by Sanmina-SCI are
> >invalid
due
> >to the existance of both prior art and prior patents.
> >
> >
> > > [Original Message]
> > > From: Andresakis, John <John.Andresakis@xxxxxxxxxxxxx>
> > > To: Gilles Aminot <aminotg@xxxxxxx>; si-list@xxxxxxxxxxxxx
> ><si-list@xxxxxxxxxxxxx>
> > > Date: 8/30/2006 8:45:29 PM
> > > Subject: RE: [SI-LIST] What is the acceptable minimum pre-preg
thickness
> >for volume manufacturing?
> > >
> > > Gilles,
> > >
> > > Depending on the copper weight and the area of copper retained,
> > > you
can
> >use
> > > lower than 4 mils. The situation is that Sanmina has a patent for
> >forming a
> > > capacitor plane in-situ, which is what you are trying to do. It
> > > makes
no
> > > difference whether you purchase a 2 mil core or use 2 mil prepreg
between
> >a
> > > power and ground plane during pressing, it still is covered by
patents.
> > >
> > > Best Regards,
> > >
> > > John Andresakis
> > > Oak-Mitsui Technologies
> > > (518) 686-8088
> > >
> > > -----Original Message-----
> > > From: Gilles Aminot
> > > To: si-list@xxxxxxxxxxxxx
> > > Sent: 8/30/2006 10:44 PM
> > > Subject: [SI-LIST] What is the acceptable minimum pre-preg
> > > thickness
for
> > > volume manufacturing?
> > >
> > > Hi All,
> > > Is there a PCB guru out there who can tell me what is the minimum
> > > recommended pre-preg thickness for volume manufacturing? I want to
> > > increase inter-plane capacitance by reducing the pre-preg
> > > thicnkess between my power and ground planes. Currently we are
> > > using a pre-preg thickness of 4mils. I did some research and found
> > > that pre-preg comes
in
> > > thicknesses as low as 2mils. Can we go as low as 2mils between
> > > planes
on
> > > an FR-4 PCB designed for RoHS compliance and still have a board
> > > which can be reliably built in high volume?
> > >
> > > Thanks in advance for your replies.
> > >
> > > Kindest Regards,
> > > Gilles Aminot
> > >
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