[SI-LIST] Re: Thick vs. thin diff. pairs
- From: Scott McMorrow <scott@xxxxxxxxxxxxx>
- To: dave.instone@xxxxxxxxxx
- Date: Mon, 20 Nov 2006 13:00:40 -0500
Interestingly enough, it's usually the backplane connectors that dictate
the total width that a differential pair can occupy between the pins. I
like to adjust the outside edges of the two tracks to be within minimum
spacing to the PTH antipads, and then adjust the width toward the center
of the pair for 100 ohm impedance. This minimizes loss, maximizes
process impedance control, and makes best use of the board area.
Connector channel pitch then dictates pair-to-pair spacing, and that
will almost always meet Tx to Rx pair crosstalk requirements.
On line-card and supervisor cards, I tend to go for narrow pair designs
that will route through 1mm pitch BGA fields. I'm a bit different than
most others. I like narrow traces, because of the increased trace
resistance. I find that resistive losses help to de-Q impedance
discontinuities, which is a good thing, and having higher trace
resistance at each end of the line helps to buffer those low loss
backplane connectors, traces, and dielectrics, that can ring like a
bell. There are so many discontinuities that you can't get rid of them
all, and I tend to want a bit of resistive buffer to absorb the worst
resonances. I like to keep the equalizer's job simple, and as a result,
most of my designs meet margins with only pre-emphasis or de-emphasis.
All those other stages in Tx and Rx filters are there to deal with
channel non-linearity due to resonance.
Scott McMorrow
Teraspeed Consulting Group LLC
121 North River Drive
Narragansett, RI 02882
(401) 284-1827 Business
(401) 284-1840 Fax
http://www.teraspeed.com
Teraspeed? is the registered service mark of
Teraspeed Consulting Group LLC
David Instone wrote:
> Mark,
> One plus point for wide traces is that the etching tolerance, +/- 1 mil
> on a 10 mil trace has less effect than +/- 1 mil on a 4 mil trace, same
> goes for the spacing between the pairs.
>
> Dave Instone
> Oxford Semiconductor Ltd
> 25 Milton Park
> Abingdon
> Oxon ox14 4sh
> UK
> www.oxsemi.com
> +44 (0)1235 824963
>
>
>
> Mark Burford wrote:
>
>> Dear all,
>> I would like to ask opinions, on the merits and disadvantages of using
>> wide or narrow microstrip lines.
>>
>> >From where I am sitting it looks like narrow microstrip diff. pairs have
>> it won hands down.
>>
>>
>>
>> Thick lines:
>>
>> More area...which gives more dielectric loss as dielectric loss over
>> takes skin effect losses at higher frequencies.
>>
>> More S11 because any corner on the line will give a greater area and
>> more capacitance.
>>
>> Thicker substrates to keep the impedance at the right value.
>>
>> As thicker microstrip lines go round a bend, the inter-pair skew will be
>> more than for two narrow lines.
>>
>> There is also the possibility of increased EMI from thicker substrates
>> (been reading antenna design books).
>>
>>
>>
>> So please someone tell me why should we use thicker lines? And also
>> please could someone tell me the trip ups of HDI (high density
>> interconnect) such as how small can one realistically go with back plane
>> and inter-chip routing?
>>
>>
>>
>> Thanks
>>
>> Mark
>>
>>
>>
>>
>>
>>
>>
>>
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- From: Mark Burford
- [SI-LIST] Re: Thick vs. thin diff. pairs
- From: David Instone
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- [SI-LIST] Re: Thick vs. thin diff. pairs
- From: bratfest
- [SI-LIST] Thick vs. thin diff. pairs
- From: Mark Burford
- [SI-LIST] Re: Thick vs. thin diff. pairs
- From: David Instone