[SI-LIST] Signal Integrity / Package Modeling Job Opening
- From: "Steven Rosser" <rossersg@xxxxxxxxx>
- To: si-list@xxxxxxxxxxxxx
- Date: Wed, 19 Nov 2003 14:32:14 -0500
Greetings,
We have a job opening for an engineer with experience in the Signal
Integrity and Package Modeling fields. Specifically, we are looking for
someone with a strong EM background, with experience in interconnect
design, modeling, simulation, and lab characterization. Applications
include high-speed digital, RF analog packaging, and high-speed
backplanes. Experience with 2D and 3D field solvers (Ansoft SI2D/3D,
HFSS), and simulators (HSPICE, Ansoft Serenade, ADS) is desired. A
familiarity with general signal and power integrity issues such as
crosstalk, SSIO, impedance control, return and insertion loss, jitter, and
power system decoupling is required. This job includes interaction with
the customer as well as the product development, manufacturing, and sales
teams. Endicott Interconnect Technologies is a young (born on 11/2002)
and hungry company that was previously the organic packaging arm of the
IBM Microelectronics Division. Our high-performance products include, but
are not limited to, PWB's, Chip Carriers, PWB assembly, physical design
and modeling services.
For more details, see the job posting on monster.com @
http://jobsearch.monster.com/getjob.asp?JobID=19606117&AVSDM=2003%2D10%2D21+20%3A32%3A00&Logo=1&col=dltci&cy=US&brd=1%2C1862%2C1863&lid=&fn=&q=endicott+interconnect+technologies.
I would encourage interested applicants to submit a resume to the above
website. Alternatively, the resume can be emailed to myself or my
manager, Joe Sniezek, at joseph.sniezek@xxxxxxxxx
Regards,
Steve Rosser
Endicott Interconnect Technologies, Inc.
email: rossersg@xxxxxxxxx
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