Ibrahim wrote: > >Ray, >Thanks for taking time to educate people. I have question on your >following comments: > >"Now assume you are decoupling a high frequency processor running at 1 >GHz. Say you chose a decap that resonates at 1GHz." > >Question is tha: >1. Is there a relationship between the processor running at 1GHz and >the decap resonating at 1GHz We select decoupling capacitors whose series resonant frequencies are such that the superposition of the impedance profiles of the numerous caps form a composite impedance profile whose magnitude is below a certain calculated target impedance. A PDS (Power Distribution System) contains various elements that contribute to the total impedance profile. At low frequencies the VRM output impedance is the dominating factor up to say several hundred KHz. Above that bulk capacitors take over up to perhaps a MHz or so. From that frequency up to about 100 MHz or so the ceramic decaps determine the impedance profile. Above a a 100 MHz or so, the interplane capacitance of the power planes becomes the predominant source of decoupling up to the GHz region. The exact frequencies quoted above are approximate and fuzzy, but serve to illustrate the trend. The various impedances presented by the various mechanisms kind of blur into each other at the transition points to create a continuum from "DC to Daylight" so to speak. My example might have been a little misleading. As it turns out the decoupling caps utilized to create the composite impedance profile that I just mentioned usually have resonant frequencies from a few MHz to say a couple hundred MHz. Above a few hundred MHz, the interplane capacitance takes over and is effective into the GHz. At spot frequencies (say buss frequencies, clock frequencies and harmonics thereof etc.) above a 100 MHz or so, small decaps can be chosen to target these spot frequencies for EMI purposes. So the example of a decap resonanting a 1 GHz was little extreme. It might be hard to find a decap that really resonates that high. Also note that high frequencies inside a processor or ASIC package are isolated from the effects of on board decoupling by the low pass nature of the package. Effective decoupling of the silicon quite often depends on package and chip level decoupling. No matter how well a PCB might be decoupled, the isolating effect of the package prevents much of the current provided by the PCB decoupling capacitors from being available to the current sinking silicon at the rates at which it needs to be supplied, hence the need for decoupling on the silicon side of the package parasitics. >2. How do we find the resonance frequecny of a cap The resonant frequency of a decap is a function of three things: The capacitors capacitance, the parasitic inductance inside the capacitors package, and the mounting inductance contributed by the pads, escapes, vias and planes. This is very geometry dependent. Given that you know the values of the C and L's then you can easily calculate the resonant frequency: Fo= 1/(2*pi*sqrt(LC)) Or you could measure the SRF in the lab on a test board utilizing a VNA. > >Thanks for your time. >Regards >Ibrahim Khan Hope that helps out. -Ray Anderson Sun Microsystems Inc. ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List archives are viewable at: //www.freelists.org/archives/si-list or at our remote archives: http://groups.yahoo.com/group/si-list/messages Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu