[SI-LIST] Package in IBIS Bench Files

Hi,
I have a driver and receiver IBIS file, both made from the bench.  When I 
simulate a topology of the driver to receiver with termination, I see more 
ringing than
an equivalent setup in the lab.  When I remove the package data from both 
the driver and the receiver, then my simulated results correlate to the 
lab results.
The I-V data was extracted from the bench, and the devices were in 
packages.  Nothing has been done to "filter" the effects of the package in 
the I-V data.
It seems that when the RLC package parsitics information is added to the 
IBIS files under the Package section, then the package is being 
"double counted" and this is adding to the excess ringing I am seeing in 
simulations.  (These are differential devices with a 100 Ohm termination 
across 1 inch
of FR-4 material. ) 

When making an IBIS file from the bench, how should the package be 
accounted for? If the package is in the I-V data, is it appropriate to 
leave out the 
package information in the IBIS file and say the IBIS file is only valid 
for that package type? 

Thank you for your comments,
Tim



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