[SI-LIST] Package in IBIS Bench Files
- From: "Timothy Coyle" <Timothy.Coyle@xxxxxxx>
- To: si-list@xxxxxxxxxxxxx
- Date: Fri, 26 Jul 2002 08:57:16 -0400
Hi,
I have a driver and receiver IBIS file, both made from the bench. When I
simulate a topology of the driver to receiver with termination, I see more
ringing than
an equivalent setup in the lab. When I remove the package data from both
the driver and the receiver, then my simulated results correlate to the
lab results.
The I-V data was extracted from the bench, and the devices were in
packages. Nothing has been done to "filter" the effects of the package in
the I-V data.
It seems that when the RLC package parsitics information is added to the
IBIS files under the Package section, then the package is being
"double counted" and this is adding to the excess ringing I am seeing in
simulations. (These are differential devices with a 100 Ohm termination
across 1 inch
of FR-4 material. )
When making an IBIS file from the bench, how should the package be
accounted for? If the package is in the I-V data, is it appropriate to
leave out the
package information in the IBIS file and say the IBIS file is only valid
for that package type?
Thank you for your comments,
Tim
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