[SI-LIST] Re: New College Grad Opening in SI team of LSI Corp

  • From: <Christopher.Jakubiec@xxxxxxxxxxxx>
  • To: <praveensoora@xxxxxxxxx>, <si-list@xxxxxxxxxxxxx>
  • Date: Tue, 23 Mar 2010 04:14:59 +0100

Would you also consider conscious candidates?..............I could not help 
myself there :)

Chris
Infineon
 

-----Original Message-----
From: si-list-bounce@xxxxxxxxxxxxx [mailto:si-list-bounce@xxxxxxxxxxxxx] On 
Behalf Of Praveen Soora
Sent: Monday, March 22, 2010 8:22 PM
To: si-list@xxxxxxxxxxxxx
Subject: [SI-LIST] New College Grad Opening in SI team of LSI Corp

We have an immediate opening in Milpitas, CA for a recent college graduate 
passed out in May' 09 or later. Candidates who don't meet this requirement will 
not be considered. Please review job requirements below and forward your resume 
to me directly at praveensoora@xxxxxxxxx Thanks,

Praveen Soora

Hiring Manager,

LSI Corp, Milpitas, CA.


*Signal Integrity Engineer*

Job Responsibilities:

Work in a co-design environment by validating different high speed interfaces 
in spice simulations. Develop IP implementation guidelines based on feasibility 
analysis and support internal design teams. Provide complete application 
support to customers by providing SI Kits, Timing Budgets and System Design 
Application Notes.Develop required bench software and firmware to validate high 
speed DDR interface systems working in the lab. Correlate lab measurements to 
simulations and create detailed reports on analysis and measurements. Provide 
support to customers on board bring up and verification.



Skills and Qualifications Required:

   - *Education Requirements:* New College Graduate with MSEE degree passed
   out in May 2009 or later. Internship experience in related field is
   preferable.
   - Strong background in SI/PI/EMC related course work with proficiency in
   Circuit theory, Electromagnetic theory, Transmission-line theory.
   - Knowledge of IO and Signal Integrity parameters: SSO noise,
   reflections, crosstalk, ISI with understanding on design trade-off analysis.
   - Experience using lab measurement tools such as oscilloscopes, TDR, VNA
   and software tools such as Labview, PLTS.
   - Knowledge of ASIC/FPGA, package and board design flow. Familiarity with
   different types of package technologies used for high speed interfaces.
   - Familiarity with Signal Integrity analysis using tools such as HSPICE,
   Agilent ADS, Sigrity Power-SI, Ansoft HFSS, Apache tools.
   - Programming skills in Excel, PERL, C, Verilog and Matlab is preferred.
   - Strong written and oral communication and customer service skills.


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