[SI-LIST] Re: Lee Ritchey's book
- From: "Rich Peyton" <p2rich@xxxxxxxxxxxxx>
- To: <weirsp@xxxxxxxxxx>, <si-list@xxxxxxxxxxxxx>
- Date: Thu, 6 Nov 2003 06:55:25 -0500
Sounds like a very interesting book! Does anyone, who has it, have any
comments on how the subjects are presented within the book?
No more comments about the price--please.
Rich
-----Original Message-----
From: si-list-bounce@xxxxxxxxxxxxx [mailto:si-list-bounce@xxxxxxxxxxxxx] On
Behalf Of steve weir
Sent: Wednesday, November 05, 2003 7:38 PM
To: si-list@xxxxxxxxxxxxx
Subject: [SI-LIST] Lee Ritchey's book
To all those curious about Lee's new book: "Right the First Time, A
Practical Handbook on High Speed PCB and System Design, Volume One" here
is the table of contents:
Chapter 1: Introduction
Chapter 2: The Electrical Engineering Problem
Chapter 3: Mjor Elements in an Electronic System
Chapter 4: Assumptions Often Made About Electronic Systems
Chapter 5: How Different from Ideal Real Systems and Their Components
Are
Chapter 6: Transmission Lines
Chapter 7: What's Moving on a Transmission Line
Chapter 8: Basics of Eletromagnetic Fields
Chapter 9: Digital vs. RF/Microwve vs. Analog
Chapter 10: Time and Distance
Chapter 11: Inductance
Chapter 12: Capacitance
Chapter 13: Resistance
Chapter 14: Fundamentals of Transmission Lines
Chapter 15: The Concept of Ground and Power Planes
Chapter 16: Impedance
Chapter 17: Relfections-What Causes Them, What They Do to a Signal
Chapter 18: What is Meant by Signal Integrity Engineering
Chapter 19: When is a Design High Speed
Chapter 20: Controlling Reflections by Using Terminations
Chapter 21: Terminator Type, Terminator Placement and Net Sequencing
Chapter 22: Stubs on Transmission Lines?
Chapter 23: Properies of Transmission Lines that Affect Impedance
Chapter 24: Methods for Calculating and Measuring Impedance
Chapter 25: Right Angle Bends and Vias Potential Sources of Reflections
and
Other Problems
Chapter 26: Types of Drivers or Sources
Chapter 27: Types of Loads
Chapter 28: Bus Protocols
Chapter 29: Crosstalk or Coupling
Chapter 30: Single Ended Signaling
Chapter 31: Differential Signaling
Chapter 32: The Power Subsystem
Chapter 33: Power Distribution DC Drop
Chapter 34: Decoupling Capacitors
Chapter 35: Power Subsystem Inductance
Chapter 36: Power Dissipation Estimate
Chapter 37: Example Power Subsystem Design
Chapter 38: IC Packages-Vcc and Ground Bounce or SSN
Chapter 39: Noise Margins
Chapter 40: Design Rule Creation Using Noise Margin Analysis
Chapter 41: PCB Fabrication Process
Chapter 42: PCB Materials
Chapter 43: Crating PCB Stackups
Chapter 44: Types of Vias
Chapter 45: PCB Design Process
Chapter 46: PCB Routing
Chapter 47: Documentation
Chapter 48: The Ideal Component Data Sheet
Glossary
Appendix 1: Bibliography
Appendix 2: Anatomy of a Plated Through Hole
Appendix 3: Selecting PCB Suppliers
Appendix 4: A Page of Useful Equations
Appendix 5: Technology Table Explanation
Appendix 6: Drill Table
Appendix 7: Conversion Tables
Regards,
Steve.
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