[SI-LIST] Re: IEEE CPMT inaugural meeting in Portland, OR area
- From: "Grossman, Brett" <brett.grossman@xxxxxxxxx>
- To: si-list@xxxxxxxxxxxxx
- Date: Fri, 18 Jan 2002 12:27:14 -0800
Sorry, I forgot that attachments were stripped from messages, below is the
information regarding location and time.
Thanks to Mr. McMorrow for drawing my attention to this.
Regards,
-Brett
Inaugural IEEE CPMT - Components, Packaging, and Manufacturing Society
Oregon Chapter Meeting
System-on-Package (SOP) Research at Georgia Tech's Packaging Center
Presented by Dr. Rao Tummala, Georgia Institute of Technology
Tuesday, February 26, 2002
6 PM - 8 PM
Location: Oregon Graduate Institute, Wilson Clark Dining Room
No Fee
Free Pizza and Soft Drinks will be served
Please register at www.cpd.ogi.edu/coursespecific.asp?pam=877
Lecture Sponsored by IEEE CPMT - Components, Packaging, and Manufacturing
Society
Facility Sponsored by OGI Center for Professional Development
Refreshments Sponsored by Relyent, Inc. Quick-Turn PCB Assembly
Abstract:
System-on-Package (SOP) is an emerging microelectronics and Microsystems
paradigm that is beginning to be accepted as the solution for the systems of
the next decade. The new SOP strategy being pioneered at Georgia Tech's
Packaging Research Center is capable of bridging the time and technology gap
by combining the best of on-chip integration with the best of packaging
integration. It is expected to lead to microminiaturized and convergent
microsystems with microelectronics, photonics, RF and MEMS in a single
component system. In doing so, it goes beyond traditional MCM, flip chip,
CSP, and microvia technologies.
Bio:
Professor Rao R. Tummala is an internationally recognized microelectronics
packaging expert, and heads the Packaging Research Center at the Georgia
Institute of Technology. Named by Industry Week as one of the "50 Stars in
the U.S." for industry culture and U.S. competitiveness, he has received
many prestigious awards including the IEEE David Sarnoff Award, the IMAPS
John Wagon's Award, the Materials Engineering Achievement Award, the
Distinguished Alumni Award from the University of Illinois and the Indian
Institute of Science, the American Ceramic Society Arthur Friedberg Memorial
Award and the John Jeppson Award, and the SME Total Electronic Excellence
Manufacturing Award. In 1998, Dr. Tummala received Georgia Tech's
Distinguished Professor Award.
Dr. Tummala is a prominent leader in all major packaging related
professional associations. He is a fellow of both the IEEE and the American
Ceramic Society. He is a member of the National Academy of Engineering, past
General Chair of the IEEE-ECTC, and past President of IMAPS. Currently, he
is the President of the IEEE-CPMT. Dr. Tummala has published 197 technical
papers and holds 67 patents and inventions. He is co-editor of four widely
used Microelectronics Handbooks and is editor of the "Fundamentals of
Microelectronic Systems Packaging" undergraduate textbook.
Dr. Tummala received a B.S. degree in physics, mathematics and chemistry
from Loyola College in India, a B.E. degree in metallurgical engineering
from the Indian Institute of Science, an M.S. degree in metallurgical
engineering from Queen's University in Canada, and a Ph.D. degree in
Materials Science and Engineering from the University of Illinois. He joined
the faculty of the Electrical and Computer Engineering Department at Georgia
Tech in 1993 as Petit Chair Professor in Electronics Packaging in ECE and
MSE schools and as a Georgia Research Alliance Eminent Scholar. Prior to
this, he was an IBM Fellow at IBM Corporation.
IEEE CPMT:
The IEEE CPMT Society's objectives are to provide a forum for the
dissemination of technical information within areas encompassing the
materials science, chemical processes, reliability technology, mathematical
modeling, education and training utilized in the design and production of
discretes, hybrids, and electronic packaging. Also included are fiber
optics, connector technology, and semiconductor processing. Manufacturing
technology includes systems, concepts, management, and quality as they
relate to electronic component manufacturing and assembly.
This is the inaugural meeting of the Oregon Chapter of the CPMT. For
information about participation as an active member of this CPMT Chapter, or
for additional information about the IEEE, CPMT or the January 16 program,
please contact:
Gary Romans, Relyent, Inc. Quick-Turn PCB Assembly, 503-466-1295,
romansg@xxxxxxxxxxxxxxx
Or
James Morris, Professor & Chair,
Department of Electrical & Computer Engineering,
Portland State University, 503-725-9588, jmorris@xxxxxxxxxxxx
Gary Romans
Sales Manager
www.Relyent-Inc.com
romansg@xxxxxxxxxxxxxxx
(503) 466-1295
Relyent specializes in hand assembly and/or modification of printed circuit
boards, servicing engineers during the prototype development process and
manufacturers for low-volume production runs.
-----Original Message-----
From: Grossman, Brett [mailto:brett.grossman@xxxxxxxxx]
Sent: Friday, January 18, 2002 12:01 PM
To: si-list@xxxxxxxxxxxxx
Subject: [SI-LIST] IEEE CPMT inaugural meeting in Portland, OR area
All,
I wanted to send you the following information on free (that's right, free)
presentation being held at Oregon Graduate Institute (OGI) that is being
sponsored by the newly forming Portland, Oregon chapter of the IEEE CPMT
society.
Dr. Rao Tummala, Director of Georgia Tech's Packaging Research Center, and
current president of the IEEE CPMT society has graciously agreed to come to
the Northwest and offer a presentation of his research in System On Package
(SOP) technology. Dr. Tummala is recognized as a premier researcher in the
area of electronic packaging, and this is a great opportunity to come listen
to him right in our backyard. The topic and biography are covered further in
the attached document, as well as information on registering for this talk.
This is the inaugural meeting, and we are looking to establish a strong
presence in the NW, and as I mentioned it is FREE and their is no
obligation. The CPMT society covers all areas of packaging from
manufacturing/testing to mechanical performance to electrical performance
and is one of the IEEE's leading sponsors of conferences both domestic and
international. Besides being educational, this should be a great networking
opportunity as well.
I look forward to seeing you there, and would greatly appreciate it if you
felt free to forward this announcement to any colleagues/friends in the
Portland/Vancouver area who you think might be interested.
Thanks and regards,
Brett
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