[SI-LIST] Re: Gen2 PCIe packaging interconnect questions
- From: steve weir <weirsi@xxxxxxxxxx>
- To: DMalladi@xxxxxxxxxxx
- Date: Sun, 27 May 2007 03:22:44 -0700
Depending on what else is in the package, wire bond s/b doable, but you
better get a hold of some expertise early so that you don't design
yourself into an inescapable corner. If you are doing a lot of serdes
channels you need to be very concerned about crosstalk. Planning the
PCB layout, die bond-out and package all need to happen together.
Steve.
Dev Malladi wrote:
> All, I am not an electrical packaging guy and I have a simple question.
> Is a flip chip interconnect required a Gen2 PCIe switch? Why and what is
> the downside of doing a wire bond at Gen 2 speeds.
>
>
> Thanks
>
>
>
> Dev Malladi
>
> Director, Packaging Operations
>
> 870, W. Maude ave
>
> Sunnyvale, CA. 94085
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> (408) 962 3475
>
> (408) 774 2169 (Fax)
>
>
>
>
>
>
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