[SI-LIST] Re: Flux
- From: "Degerstrom, Michael J." <degerstrom.michael@xxxxxxxx>
- To: p2rich@xxxxxxxxxxxxx, si-list@xxxxxxxxxxxxx
- Date: Fri, 4 Jan 2002 11:25:09 -0600
Rich,
> -----Original Message-----
> From: Rich Peyton [mailto:p2rich@xxxxxxxxxxxxx]
>
> I'm referring to the effects that Flux has on
> interconnections between the signal paths when soldering has
OK - so what are the affects that would concern a signal
integrity engineer? Is there significant DC
leakage, high AC losses or changes in propagation delay
caused by the residue? Your original posting stated
that you saw effects with respect to high speed testing.
Or did I misunderstand?
> to be done. Specifically referring to " No Clean" solder
> does leave a film/gummy residue behind. The Spec on this
> particular "No Clean" solder passed Bellcore TR-NWT-000078
> spec, but that spec was replaced by Bellcore-GR-78-CORE spec.
> Now I don't have either spec so maybe the newer spec tighten
> up the allowable SIR ( surface Insulation Resistance )?
>
> Rich
> -----Original Message-----
> From: si-list-bounce@xxxxxxxxxxxxx
> [mailto:si-list-bounce@xxxxxxxxxxxxx]On Behalf Of Degerstrom,
> Michael J.
> Sent: Friday, January 04, 2002 11:05 AM
> To: p2rich@xxxxxxxxxxxxx; si-list@xxxxxxxxxxxxx
> Subject: [SI-LIST] Re: Flux
>
>
>
> Rich,
>
> Could you please elaborate on your comments below?
> Specifically, what does flux or other material have to do
> with signal integrity? I'm envisoning a film left on the
> surface of high speed microstrips that contributes to loss.
>
> Mike
>
> > -----Original Message-----
> > From: Rich Peyton [mailto:p2rich@xxxxxxxxxxxxx]
> > Sent: Thursday, January 03, 2002 10:22 AM
> >
> > Signal Integrity was improved with both cleaning processes
> but there
> > was a small percentage that still had contaminates/film left behind
> > which had effects on high speed testing ( Kester being the worst ).
> >
> > Any comments/ articles/ web info / data would be appreciated :-)
> >
> > Thanks to those who reply,
> >
> > Rich
> >
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