[SI-LIST] Cost Factor of introducing Blind and Buried Vias
- From: Adeel Malik <AdeelM@xxxxxxxxxxxx>
- To: si-list@xxxxxxxxxxxxx
- Date: Tue, 13 Aug 2002 16:14:06 +0500
Hi All,
I am designing a 10-layer board having 6-signal layers and 4 ground
planes. The baord has 4 BGA1156 Packages as well as QFP208 Packages. Due to
the routing denstiy, I have to use many vias which perforate the planes thus
enervating the integrity of power and ground planes. I expect the no. of
through-holes to be about 3000 . Can someone give me the crude approximation
that by how much times the cost of the Board will multiply if I introduce
Blind and Buried Vias ,thus reducing the through-hole vias piercing the
planes to about 200-300 instaed of 3000.
ADEEL MALIK,
Design Engineer,
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