[SI-LIST] Re: Bypass Capacitance?

  • From: DAVID CUTHBERT <telegrapher9@xxxxxxxxx>
  • To: gnuarm.2006@xxxxxxxxx
  • Date: Mon, 12 Mar 2012 11:56:09 -0600

And you can experience parallel resonances between different value
capacitors.
Dave Cuthbert
On Mar 12, 2012 9:08 AM, "Rick Collins" <gnuarm.2006@xxxxxxxxx> wrote:

> In this case, the flaw in the thinking was that you need to pick a
> single package size for your decoupling caps.  If you just give it a
> moments thought you will realize you don't do this anyway.  Don't we
> ALlWAYS include a large package tantalum or electrolytic capacitor to
> the mix to provide enough bulk capacitance to provide a low impedance
> all the way down to the active frequency range of the regulator?
>
> Yes, that is why thought experiments are of limited value and it is
> important to simulate and even build and test your ideas.  (That's
> why I liked Lee Ritchey's class so much, it backed up everything he
> said with theory, simulations and even testing on boards usually
> built for the purpose).  The fly in the ointment of this approach is
> that there is no reason to stick with a single size of capacitor as
> presented.
>
> In your case you have picked 0402 as your package size.  This package
> will have less package inductance, but will also have a lower maximum
> capacitance than larger body caps.  Using the maximum value of
> capacitance available in this package will provide a good response at
> the high frequency end when combined with power and ground planes,
> but it will require many, many more caps to reach the desired
> impedance at lower frequencies than if you use a larger
> package.  Likewise if you pick a single, larger package size the
> higher inductance will provide a higher impedance at higher frequencies.
>
> Using a combination of capacitance values and packages, you will be
> able to add enough capacitance to provide a low impedance across the
> frequency spectrum using much fewer devices and less board space.
>
>
> Regards,
>
> Rick
>
>
> PS  If Lee Ritchey reads this, I am still not receiving your messages
> posted to the group... go figure.
>
>
> At 06:15 AM 3/12/2012, Elya B. Joffe wrote:
> >Dear all,
> >  From what I recall from Howard Johnson's teachings (which I find much
> >rational in), I recall the following:
> >
> >   * Once you have chosen a size (and technology) of a capacitor
> >     (primarily ceramic) take the largest capacitive value you have in
> >     that package. You have already paid your dues in terms of ESL
> >     (inductance).
> >   * There is no benefit in paralleling various values of ceramics (e.g.,
> >     1nF, 10nF, 100nF), as a corollary of the previous bullet. If you
> >     use, for instance. 0402 package X7R capacitors, then in the higher
> >     frequencies, their inductance is equal almost (based on package) so
> >     you achieve very little improvement at the higher frequencies, at
> >     most you achieve the ESLs in parallel; in the lower frequencies,
> >     where capacitance dominates, what is the benefit in
> >     1nF||10nF||100nF? After all, that is almost 100nF? I prefer to
> >     parallel equal values (maximum per package).
> >   * If you parallel caps with different ESLs (say 1nF @ 0402, 10nF @
> >     0603 and 100nF @ 0805 - not that there is a reason for those sizes
> >     in those values...), you WILL encounter parallel resonances between
> >     ESLs of the larger caps and the capacitance of the smaller caps...
> >     Regretfully (?!?) ceramic caps have very little ESR, so you may
> >     experience a relatively high-Q parallel resonance... The fact that
> >     this might happen in the vicinity of the switching device, where a
> >     very broadband spectrum of delta-I/SSN exists, might even worsen the
> >     outcome of this mechanism... Normally, the PDN will include bulk
> >     caps at the input to the board, and those should address the lower
> >     frequencies, so I see no reason to address the lower frequencies at
> >     the vicinity of the switching devices. However, containment of high
> >     frequency noise near the switching device is definitely beneficial...
> >   * Regretfully, today there is a trend of using large (up to 22uF)
> >     ceramic caps instead of tantalum, for "bulk capacitance. These add
> >     "double trouble". Because of their large value their package is very
> >     large, this their ESL is relatively HUGE... On the other hand, being
> >     ceramic results in a very low ESR, so resonances are not suppressed
> >     very well. I have actually seen cases where designers have added
> >     small resistance in series with the large ceramic caps (emulating
> >     the "natural" ESR of the tantalum caps...).
> >
> >Just a few comments which I hope you may find useful.
> >
> >Cheers,
> >
> >Elya B. Joffe
> >
> >
> >On 3/11/2012 4:45 AM, Rick Collins wrote:
> > > First, let me say that I am no expert in power distribution system
> > > (PDS) design.  I took a class with Lee Ritchey a few years back and
> > > tried to absorb everything he taught in that class, which PDS was a
> > > small part of.  There were several points he made which stuck with
> > > me.  We'll see how well I remember...
> > > 1) To be effective, the impedance of the PDS has to be adequately low
> > > across the frequency spectrum.  Using a single value or type of
> > > capacitance won't give you that in most situations because capacitors
> > > are capacitive below their resonance and the impedance
> > > rises.  Capacitors are inductive above their frequency of resonance
> > > and the impedance also rises.  Larger values of electrolytic or
> > > tantalum capacitors are used to get low impedance at lower
> > > frequencies.  Ceramic caps provide low impedance at higher
> > > frequencies.  Using power planes to form capacitors provides low
> > > impedance across a range of very high frequencies that discrete
> > > capacitors can't provide.
> > >
> > > 2) Discrete capacitors have effective series resistance (ESR), even
> > > ceramics, which will mitigate the anti-resonance peak in impedance
> > > created when more than one value/type of capacitor is used.  If
> > > multiple values of ceramic capacitors are used (more than two) the
> > > peaks are typically well mitigated.  The power planes also have some
> > > effect in this but I seem to recall it was rather complicated with
> > > lots of ripple at very high frequencies (>  1 GHz), possibly having to
> > > do with reflections at the edges of the board, standing waves
> > > perhaps?  What I took away from this was to use 1, 10 and 100 nF
> > > ceramic caps in addition to the power planes and you should be
> > > good.  You don't need TONS of each part.  Lee showed us how to
> > > calculate the requirement, but it was based on knowledge of the
> > > current spikes of your chips.  If you don't know that there is no way
> > > to actually know what your PDS requirements are.  I've never seen
> > > this data on any of the chips I use...
> > >
> > > 3) When good power planes are used, discrete capacitors do not need
> > > to be extremely close to the chip they are decoupling.  In essence
> > > the distance to the cap creates a "delay" in action while the E field
> > > propagates to the cap and back to the chip.  The capacitance of the
> > > power plane provides adequate decoupling during this delay
> > > time.  Think of the power plane as a very low impedance transmission
> > > line.  Lee actually constructed a test board and measured the results
> > > as the decoupling cap was placed up to more than an inch away from
> > > the chip (maybe as much as three inches?).  The difference in voltage
> > > variation at the chip was small.
> > >
> > > I hate to be spouting all this off because I have not had a lot of
> > > opportunity to verify it.  I may have learned some of it wrong.  But
> > > I am sure it will get a good vetting here and I'll find out if I did
> > > learn any of it wrong.
> > >
> > > BTW, in case you haven't figured it out, I highly recommend Lee's
> > > class at speedingedge.com
> > >
> > > Rick
> > >
> > >
> > > At 04:34 AM 3/11/2012, Aaditya Kandibanda wrote:
> > >> Hello Rick, thank you very much, I am somewhat confused about the
> > >> ground plane and power plane capacitance which is formed because of
> > >> stack up, what is its importance?
> > >>
> > >> On Sat, Mar 10, 2012 at 11:22 PM, Rick Collins
> > >> <<mailto:gnuarm.2006@xxxxxxxxx>gnuarm.2006@xxxxxxxxx> wrote:
> > >> I don't think it can hurt the devices you are trying to supply power
> > >> to, but some voltage regulators can be sensitive to low effective
> > >> series resistance (ESR) capacitors, like ceramic caps.  If you
> > >> provide too many of the low ESR caps the total capacitance can
> > >> destabilize the regulator to the point of oscillations.  If this is a
> > >> problem, they should tell you the upper limit of capacitance to use.
> > >> Rick
> > >> At 03:53 AM 3/11/2012, Aaditya Kandibanda wrote:
> > >>> Hello Everyone,
> > >>> I have a doubt on bypass capacitors, will there be any specific
> limit to
> > >>> the capacitance I can use for bypassing? what if my bypass
> capacitance is
> > >>> very large value? will it be okay?
> > >>>
> > >>> Thank you in advance,
> > >>> Aaditya
> > >>>
> > >>>
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