Hey users, Not sure if this has been covered or not, but I'm researching a 'grey' area again, and thought I'd bounce the question here first. When creating the footprints for buried devices (resistors, caps, inductors, etc.) how are the pads defined, so that the device can be used on various layers? Do you make ALTERNATE parts with differently defined padstacks? Can I even use conventional padstacks or do they need to be 'pad shape' defined pads? Thought I'd check here for responses. Good day. Mitch ----------------------------------------- Stay ahead of the information curve. Receive PCB news and jobs on your desktop daily. Subscribe today to the PCB CafeNews newsletter. [ http://www10.pcbcafe.com/nl/newsletter_subscribe.php ] It's informative and essential. ----------------------------------------------------------- To subscribe/unsubscribe: Send a message to icu-pcb-forum-request@xxxxxxxxxxxxx with a subject of subscribe or unsubscribe To view the archives of this list please login at //www.freelists.org. Our list name is icu-pcb-forum or go to //www.freelists.org/archives/icu-pcb-forum/ Problems or Questions: Send an email to icu-pcb-forum-admins@xxxxxxxxxxxxx Want to post a job listing ? DON'T DO IT HERE! Better yet, join our jobs listing forum. SUBSCRIBE: icu-jobs-forum-subscribe@xxxxxxxxxx POST: icu-jobs-forum@xxxxxxxxxx -----------------------------------------------------------