[ibis-interconn] Re: Suggested Plan for IBIS Packaging and On_Die Interconnect Modeling
- From: "Lynne C. Green" <lgreen22@xxxxxxxxxxxxxx>
- To: Ibis-Interconn <ibis-interconn@xxxxxxxxxxxxx>
- Date: Thu, 20 Sep 2012 18:42:28 -0700
Since I am new to this group, I would like to pose a Question to the group:
What would members think of starting with a "quick" solution of adding
one keyword for language (Touchstone, ISS-SPICE) to [Package Model]?
Benefits? Limitations?
Some preliminary thoughts along those lines:
- Fast implementation, with a minimum of new keywords, no new model type.
- Might also work for EBD?
- Could be made flexible enough for future needs (Walter's keywords)?
- Impact on EDA tools (person-months)?
- Impact on parser development?
- Impact on model makers, EDA tools, model users?
- Could on-die power distribution info be captured in [Model]?
Personally, I am philosophically inclined to keep package and die
separate within IBIS. Often a chip can go in any of several packages,
and a package can fit any of several chips.
Cheers,
Lynne
"IBIS training when you need it, where you need it."
Dr. Lynne Green
Green Streak Programs
http://www.greenstreakprograms.com
425-788-0412
lgreen22@xxxxxxxxxxxxxx
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