I would like to add my two cents here. We happened to have multiple field failures that looked very similar to the photos in Terry Munson's article, but we determined these to be silver-sulfide rather than tin whiskers. All the field failures were from high sulfide environment, one of them is a dairy farm. The needle shape crystals grew from two areas, the primary area is along the tin plating edge, and a few of them grew right from the center of endcap surface. These crystals looked different from tin whiskers I grew in my experiments, they were darker, shorter and much thicker. We think that along the tin plating edge, some silver were exposed and it started the following reaction. 2H(+) + 2e(-) -> H2 2Ag + S(2-) -> Ag2S + 2e(-) We think the silver sulfide whiskers in the middle area were caused by think tin plating. The actual failures in our case were not bridging, the product failed because of value change and complete open due to silver depletion. We have since added conformal coating for those customers that we know are in high sulfide environment, and this process change proved to be quite effective. Regards Daicheng Fu Pullman, WA From: Rod <rod.dalitz@xxxxxxxxxxxxxxxx> To: tinwhiskers@xxxxxxxxxxxxx Date: 02/16/2011 10:06 AM Subject: [tinwhiskers] Re: Tin Whiskering on PCBA Capacitors in Storage Sent by: tinwhiskers-bounce@xxxxxxxxxxxxx On 16 Feb 2011, at 16:11, Pedro Tort wrote: > An article on SMT Magazine about how and when whiskers grow on capacitors inside an ESD bag. > > http://www.ems007.com/pages/zone.cgi?artcatid=&a=74567&artid=74567&pg=1 FAscinating, but I hate the format, so much more useful as a PDF. Figure 7 seems to show curvy whiskers, almost wooly, not what I expect to see. regards, Rod rod.dalitz@xxxxxxxxxxxxxxxx