boyoboy talk about telepathy. I was just thinking of you and wondering how your trip went and was going to email you and saw this in my in-box. How did the visit with Sununu go? -----Original Message----- >From: Bob Landman <rlandman@xxxxxxxxxxxxxxxxx> >Sent: Apr 6, 2008 2:56 PM >To: "tinwhiskers@xxxxxxxxxxxxx" <tinwhiskers@xxxxxxxxxxxxx> >Subject: [tinwhiskers] Should suppliers lead the transition to pure tin? > >Lead-Free Zone Blog >Hi, this is Design News contributing editor, Rob Spiegel. Welcome to my >Lead-Free Zone blog. This is your opportunity (and mine) to discuss RoHS and >other environmental issues. Green regulations have produced waves of industry >confusion, and I do not expect things to clear up quickly. So use this blog to >inform us of your opinions, to instruct us all on what you're doing about this >initiative, or just to blow off some steam. > >http://www.designnews.com/blog/710000071/post/750022675.html? > >Friday, February 29, 2008 >Should suppliers lead the transition to pure tin? >Feb 29 2008 6:23AM | Permalink | Email this | Comments (0) | >Blog This! using: Blogger.com | LiveJournal | > > >Design Chain Associates, a company that helps manufacturers cope with >environmental compliance has released an article from its partner DfR >Solutions that looks at the state of pure tin in the electronics industry. >Here's the opening to the article: >One of the greatest concerns during this transition to Pb-free electronics, >and therefore Pb-free components, has been the supposed rapid and widespread >adoption of pure tin plating as the solderability plating of choice. A number >of questionable surveys have driven this belief, with some promoting that >'pure' tin has captured 75% or more of the market. >The response to this wave of tin-whisker susceptible components has been >impressive. Numerous organizations have sprung up to either analyze (iNEMI, >E4), inform (ELFNET, GEIA), or fight (NASA Tin Whisker Group) this potential >reliability threat. Millions have been spent on testing, analysis, report >writing, and, most importantly, material identification (have you bought stock >in XRF companies?). >Why all this time, money, and effort? Because, supposedly, the electronics >supply chain is backwards. Suppliers call the shots and the OEMs, especially >those in Hi-Rel (telecom, industrial, military, avionics, medical, etc.), have >no control over what goes in their product and out to the customer. Could we >be more wrong? For more of the article, click here: >http://www.designchainassociates.com/pdf/dfr_tm.pdf >============= >I just returned from NASA Goddard Space Flight Center where in their Tin >Whiskers group, thanks to Henning Leidecker, Jay Brusse and esp. Lyudmyla >Panashchenko's time lapse 3D photos of growing tin whiskers in a SEM, I saw >for the first time "live" tin whiskers and zinc whiskers. >Until you actually see them, unfortunately, most of you will relegate them to >UFO status. Seeing is believing, sad to say. >I just read the above article from DfR. It's an interesting argument but it >lacks completeness as it does not mention passive components such as L/C/R >parts, tin connectors and other mechanical parts such as shields - all of >which can grow whiskers and which can come loose and short circuitry or grow >to 25mm length and short to adjacent components. >Conformal coatings can mitigate the whiskers that do grow but the problem is >that the sharp edges on IC leads do not coat well with conformal coatings, so >I'm advised by NASA, unless the coatings are thickened with, for example, >cabosil. This is why NASA insists on 3% lead in solder as a minimum and >expensive XRF testing. I saw a $40K benchtop tester mfg by Fischer that did >an excellent job of analyzing coatings at their lab as well as a $500K Nikon >SEM-EDX instrument. It is very unlikely industrial companies will buy SEM-EDX >instruments. >Bob Landman >H&L Instruments,LLC