[tinwhiskers] Re: Plating thickness and whisker growth
- From: "Fritz, Dennis D." <DENNIS.D.FRITZ@xxxxxxxx>
- To: <tinwhiskers@xxxxxxxxxxxxx>
- Date: Fri, 14 Mar 2008 16:50:46 -0400
Lynn,
Please see IPC standard 4554 on fabrication of boards using Immersion Tin. I
see in my draft copies of this standard during development, there was
significant discussion of possible, but limited whiskers with immersion tin.
Some of that did not make the approved version, but Appendix 6 of 4554 calls
out the wording from IPC/JEDEC 002 on mitigation for your reference.
Anyway, IPC 4554 is the process document your supplier of boards should be
following. Immersion tin suppliers should be able to provide documentation on
the growth of whiskers when their product is run properly in a fab shop.
I am presuming your immersion tin is on the board, not on the press fit
connector.
Dennis Fritz
SAIC, Inc.
________________________________
From: tinwhiskers-bounce@xxxxxxxxxxxxx on behalf of lynn norman
Sent: Fri 3/14/2008 2:48 PM
To: tinwhiskers@xxxxxxxxxxxxx
Subject: [tinwhiskers] Plating thickness and whisker growth
We're writing a PCB spec and some of our folks are
concerned with immersion tin plating thickness. We
use a lot of press fit connectors (almost exclusively
with imm Sn), and the concern is that the thicker the
tin plating, the higher the probability of whiskering.
Does anyone know of any studies relating whisker
formation to plating thickness?
Lynn Norman
Materials Engineer
Continental Automotive
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