[tinwhiskers] International Symposium on Tin Whiskers Call for Participation
- From: "Bob Landman" <rlandman@xxxxxxxxxxxxxxxxx>
- To: "tin whiskers forum" <tinwhiskers@xxxxxxxxxxxxx>, "Leadfree@xxxxxxx" <Leadfree@xxxxxxx>
- Date: Sun, 31 Jan 2010 10:48:16 -0500
http://www.calce.umd.edu/cgi-bin/entityTools/webmultidbhtmlfrm.cgi?1997/workshops+standard.irp+8
Fourth International Symposium on Tin Whiskers Call for Participation
Thursday, January 14, 2010 | University of Maryland
Brochure http://www.calce.umd.edu/istw4.pdf
The Center for Advanced Life Cycle Engineering (CALCE) at the University of
Maryland, in collaboration with The Institute of Scientific and Industrial
Research (ISIR) at Osaka University, is pleased to announce the call for
participation for the Fourth International Symposium on Tin Whiskers.
Tin whiskers are needle-like growths that can form spontaneously on tin-based
lead-free finished surfaces. Tin whiskers present a unique challenge to the
electronics industry. Since the 1940s, there have been numerous electronics
failures caused by tin whiskers. As a result of the global transition to
lead-free electronics in the early 2000s, most electronic component
manufacturers now use pure tin or tin-rich alloys for terminal and lead
finishes. The increasing use of tin-based lead-free finishes and materials has
lead to focused research on tin whiskers, particularly for long life and
mission critical applications in aerospace, aviation and medicine, i.e.
implantable medical devices.
Research has shown that oxidation in humid atmospheres, corrosion,
intermetallic formation, stress under thermal cycling, external pressure in
fine pitch connectors and electromigration can promote whisker formation.
Despite these findings, available acceleration models for whisker growth are
limited or, in some cases, non-existent.
Over the past three years, CALCE and ISIR have organized meetings to provide
awareness and track new findings related to tin whiskers. A listing of
proceedings from past International Symposia on Tin Whiskers can be found here.
http://www.calce.umd.edu/tin-whiskers/symposia.htm
Presentations submitted for this year's symposium may cover case histories,
theories of tin whisker growth, experiments and results, risk evaluation
methods and risk mitigation strategies. Free admission will be provided to
symposium participants.
Important dates:
Abstracts due by March 12, 2010
Presentations due June 4, 2010
Symposium will be held on June 23, 2010
(Note: An extra day may be added depending on number of abstracts received.)
Organized by:
Center for Advanced Life Cycle Engineering (CALCE)
The Institute of Scientific and Industrial Research (ISIR), Osaka University
Contact:
Dr. Michael Osterman, CALCE, University of Maryland
Prof. Michael Pecht, CALCE, University of Maryland
Dr. Katsuaki Suganuma, ISIR Osaka University, Japan
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