[SI-LIST] second call for papers: ICCS 2004:Workshop on Simulation and Modeling of 3D Integrated Circuits

  • From: "Igor Balk" <ibalk@xxxxxxxxxxx>
  • To: <si-list@xxxxxxxxxxxxx>
  • Date: Tue, 25 Nov 2003 16:10:07 -0500

                                        ICCS 2004:Workshop on Simulation and 
Modeling of 3D Integrated Circuits

                                          
http://www.cyfronet.krakow.pl/iccs2004/workshops_details.html#18
                                                                07 Jun 2004 - 
09 Jun 2004
                                                                        Krakow, 
Poland

Description:
The goal of the workshop is to bring together researchers, designers,
programmers and vendors involved in 3D IC design and development in an
effort to dramatically shorten development time and reduce prototyping
costs, simulation activities have experienced phenomenal growth, generating
a large number of point solutions, as well as integrated tools. The general
subject of the meeting is the electrical modeling, design, analysis, and
characterization of electronic interconnections and packaging of 3D
integrated circuits. A forum will be provided for the discussion of the
following topics as they relate to on-chip interconnections in 3D systems:
Numerical methods and algorithms
Data Bases, Data Exchange and Translators
Process, Device and Circuit Simulation
System and Multi-level Modeling

Important dates:

Paper Submission: December 15, 2003
Notification of acceptance of papers: February 1, 2004
Camera ready papers: February 15, 2004
Early registration: March 15, 2004

Organizer: Igor Balk
address: R3 Logic
80 Sherman Street
Cambridge MA, 02140, USA
e-mail: ibalk@xxxxxxxxxxx

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