Hi,
I am having a 22-layer board with three power planes - 1/2 oz. thick power
planes near top (P1) and bottom (P3), and 1 oz. thick power plane at the
middle (P2).
One power rail at 1V needs to deliver around 20A of current to four
separate devices. The datasheet highly recommends to use 1 oz. copper
thickness which would be the one in the middle.
I want to create the power islands near the surface either in P1 or P2 so
that I can achieve lowest possible mounting inductance of power
distribution capacitors (decaps). Using middle plane P2 for this leads to
highest mounting inductance - a very bad aspect in my view.
Is it mandatory to use 1 ox. or more thick planes if current consumption
crosses around 10A?
Hoping to get some advice on this.
Thanks,
Binayak
--
Regards.
Binayak Shrestha
Research Engineer,
C-DOT Centre for Development of Telematics
------------------------------------------------------------------
To unsubscribe from si-list:
si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field
or to administer your membership from a web page, go to:
//www.freelists.org/webpage/si-list
For help:
si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field
List forum is accessible at:
http://tech.groups.yahoo.com/group/si-list
List archives are viewable at:
//www.freelists.org/archives/si-list
Old (prior to June 6, 2001) list archives are viewable at:
http://www.qsl.net/wb6tpu
