The link was munged. New one belowA reminder to register for the next
installment.
Well, it's that time for another installment in our summer Covid-19 webinar
series. John Abbott will be giving a great presentation next Thursday
High-Speed Connector SI Roundup: Strengths, Weaknesses and Trade-offs
Presented by: John Abbott
Thursday, August 27
11:15 a.m. PT | 2:15 p.m. ET
As data rates continue to rise, interconnect choices are more critical than
ever. This presentation explores the inherent signal integrity trade-offs from
different connectors types and options. Topics include: SI trade-offs of
popular PCB attachment options like BGA, SMT & press-fit, open pin field vs
dedicated ground connector designs, and the challenges of edge card designs.
https://samtec.zoom.us/webinar/register/5715906933550/WN_YrtOCghFRQOaqOriTAdnQQ
Future Sessions:
Sept 10 | Noise and Simulation Correlation | Rich Mellitz
Sept 24 | Periodic Discontinuities | Gustavo Blando
Oct 8 | Resonances, Modes and Cutoff Frequencies | Kelly Garrison
Scott McMorrow, CTO Signal Integrity Group
Samtec
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intended recipient should not disclose the content to third parties or
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Scott McMorrow,
Office: 401-284-1827
www.samtec.com
This email and any appended documents are only for the intended person/entity
and may contain information of Samtec, Inc., that is PRIVILEGED, PROPRIETARY,
CONFIDENTIAL, AND/OR PROTECTED BY LAW. If you are not the intended recipient
you are hereby notified that any dissemination, disclosure, use or copying of
this email or its contents is prohibited. If you this message in error, please
notify Samtec immediately and delete the email, attachments and all copies. The
intended recipient should not disclose the content to third parties or
reproduce the content without Samtec's written consent.
delete the email, attachments and all copies. The intended recipient should
not disclose the content to third parties or reproduce the content without
Samtec's written consent.
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