Ludvik, Yes, this approach has been in use for quite a while. A couple of things to keep in mind: - as we push for narrower traces, you may not have enough width to neck it further down reliably, but this depends on the design - more importantly, you want to compensate only for the excess capacitance, which are the one or two stubs on either vertical side of the layer transition, plus any extra capacitance coming from an impedance mismatch between the trace impedance and via-barrel impedance. In your question you assume a top-to-bottom transition, which eliminates the stubs. Still, you dont want to compensate for the entire capacitance of the via., just what may be above what is needed to match the trace impedance. Note that the compensation goes both ways. If you have for instance an 'inductive' via or any other electrically short inductive interconnect, you can add small islands or bigger pads to compensate for it. This may be the case if for instance you have to neck down a trace (and it bocemes higher impedance than required) in a dense area for routing reasons. Regards, Istvan Novak SUN Microsystems ----- Original Message ----- From: <ludvik@xxxxxxxxxx> To: <si-list@xxxxxxxxxxxxx> Sent: Saturday, October 02, 2004 4:57 PM Subject: [SI-LIST] fire extinguisher is close > Hello everybody, > > > I have a question: > > Did some of you use the following via compensation? > > > > Assume top ustrip connected by via to bottom ustrip. This via could be > modeled as C to ground, or in other words, as localized decrease in Zo of > mentioned trace. Now if we would neck down top and bottom trace for some > small distance, say 0.1", before and after via, we would introduce two local > increases of Zo. This really would be like a T (LCL) network with could > perform better that via by itself. Of course there will be an increase of > local R_skin, but maybe negligible and could be accounted for with Ls. > > > > Hopefully you will not flame me much for asking, and if yes no worry, my > fire extinguisher is close. > > :o) > > > > Ludvik Kindl > > 650-868-2675 > > > > > > > > ------------------------------------------------------------------ > To unsubscribe from si-list: > si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field > > or to administer your membership from a web page, go to: > //www.freelists.org/webpage/si-list > > For help: > si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field > > List FAQ wiki page is located at: > http://si-list.org/wiki/wiki.pl?Si-List_FAQ > > List technical documents are available at: > http://www.si-list.org > > List archives are viewable at: > //www.freelists.org/archives/si-list > or at our remote archives: > http://groups.yahoo.com/group/si-list/messages > Old (prior to June 6, 2001) list archives are viewable at: > http://www.qsl.net/wb6tpu > > ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List FAQ wiki page is located at: http://si-list.org/wiki/wiki.pl?Si-List_FAQ List technical documents are available at: http://www.si-list.org List archives are viewable at: //www.freelists.org/archives/si-list or at our remote archives: http://groups.yahoo.com/group/si-list/messages Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu