[SI-LIST] any correlation between annular ring suppression and via failure or delamination in non-woven aramid fiber PCBs?

  • From: "JNIEZNAN@xxxxxxxxxx" <JNIEZNAN@xxxxxxxxxx>
  • To: "si-list@xxxxxxxxxxxxx" <si-list@xxxxxxxxxxxxx>
  • Date: Wed, 24 Feb 2016 16:13:19 +0000

Good Morning SI-List!


This topic and concern came up in regards to GHz signal routing, but I have not 
found any references in published literature.  If there are combinations of PCB 
materials, via dimensions, design parameters, assembly processes and 
environmental usage conditions that can manifest a reliability concern I'd like 
to understand these issues and failure mechanisms, but I don't want to chase 
these ghosts and over constrain ourselves if none have been 
seen...................



Perhaps this was a problem once upon a time and has been overcome by ongoing 
technical progress and process improvements?



Thanks for any insights, technical references, history lessons or relevant 
experience you may be able to share with us.



Regards,



John


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  • » [SI-LIST] any correlation between annular ring suppression and via failure or delamination in non-woven aramid fiber PCBs? - JNIEZNAN@xxxxxxxxxx