Hello *,
thanks to all who answered for sharing your expertise!!
Hermann
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Hermann Ruckerbauer
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Am 18.03.2022 um 09:58 schrieb Alexander Ippich:
Hello Hermann,
assuming that you refer to typical higher layer count HSD boards, most PCB
shops will use 'foil lamination'. Hardly anybody would use clad / cap / core
lamination. That second type is typical for RF boards.
With foil lamination, the top layer will be a separate copper foil, then
prepreg and only then, there will be alterating dielectrics consisting of
cores/laminates and prepregs.
With core lamination, the layers L1 and L2 are on a core.
Because of that, in most HSD board, the L1 copper foil will be a different
foil than what is used on the laminates anyway. So you can use HVLP copper on
all innerlayer cores, but still stick with a more rough outerlayer foil.
Doesn't need any specials, that's what PCB shops do anyway. And from my
experience, using a more rough copper foil on outerlayers is still pretty
much the standard and you need to specifically request a smooth copper foil
for outers, if you want that.
Best regards,
alex
Alexander Ippich | Technical Director, Signal Integrity & Advanced Technology
Product Manager RF/Microwave
OEM Marketing Europe
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Sent: Friday, March 18, 2022 08:41 AM
To: si-list@xxxxxxxxxxxxx
Subject: [SI-LIST] VLP copper on outer layers
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Hello Experts,
maybe I can get some opinions for making decisions...
I see the advantage of smooth copper for high speed routing, and the
disadvantage of de-lamination for reliability.
So far i was only thinking about the de-lamination issue from a reliability
view of e. g. many temperature cycles over time.
But now i got a different aspect: is there a difference of this issue on
outer vs. inner layers ?
On outer layers pads will see additional stress due to soldering and
mechanical stress due to the components.
So I would assume that this is might be even more critical on outer layers
than on inner layers.
The only way around would be to e. g. use different PCB Material / copper on
the outer layers, but I'm not sure if this is worth the effort.
So far I'm no fan of mixed material stackups and it was more driven by cost
saving (only use the improved material where real high speed routing is used,
and maybe not for power layers).
I'm a bit conservative on this one and do not expect, that every PCB vendor
can handle material mixing out of the box...
Any feedback on theses thoughts is highly appreciated!
Hermann
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EKH - EyeKnowHow
Signal Quality - Made in Bavaria
Hermann Ruckerbauer
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