[SI-LIST] Using Fasthenry for die bumps and package ball inductance extraction

  • From: Amit Kumar <amit.j.kumar@xxxxxxxxxxxxx>
  • To: "si-list@xxxxxxxxxxxxx" <si-list@xxxxxxxxxxxxx>
  • Date: Tue, 5 May 2015 17:11:38 +0000

Hello All,
I am trying to extract inductance of different sections of my package using
Fasthenry but am not versed with the coding used to make the input file for
different structures(via,solder balls, die bumps etc).
Does anyone have handy input files for Fasthenry to extract inductance for
package die bumps, ball etc or any pointers on how to write these input files?

Regards
Amit

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  • » [SI-LIST] Using Fasthenry for die bumps and package ball inductance extraction - Amit Kumar