[SI-LIST] Re: Sr. Researcher on High-speed Interconnect Position Opening in Huawei(updated)
- From: JIA Gongxian <jgxian@xxxxxxxxxx>
- To: si-list@xxxxxxxxxxxxx
- Date: Mon, 24 Apr 2006 12:10:51 +0800
Hi, All,
There are two Full-time Job Positions Opening on High-speed Interconnect R&D
in Huawei, Please contact me if interested.
Job Details:
The High-speed interconnect research team is seeking two first-class
researchers to join a high-speed backplane interconnect project beyond 10Gbps,
research areas include as the following:
- Transmission line structures modeling and analysis;
- 3D structures (such as vias and connectors ) modeling and analysis
- Passive system channel simulation and validation;
- Improve and optimize active backplane channel simulation method;
- Jitter theory, modeling, simulation and validation;
- CDR/PLL theory, modeling, simulation;
- High-speed SERDES I/O modeling;
- High-speed signal conditioning technology research;
- New high-speed interconnect technical research and development
REQUIREMENTS
- Deep insight in the developing technical trend of High-speed interconnect;
- Deep Understanding on Signal Integrity theory;
- Familiar with Simulation tools such as Hspice and ADS, 3D field solver such
as HFSS;
- Excellent modeling ability based on measurement;
- Familiar with eye-diagram, jitter, TDR and VNA measurement;
- Familiar with High-speed I/O techniques, such as CDR/PLL, error-correction
coding theory and modeling
- Self-motivated, strong written and verbal communication skills
Location: prior to Shenzhen, China; then in Santa Clara,CA, USA
Job Type: Research and Design
Job Level: Experienced Professional
Education: Master Degree or higher
Experience: >4 years
Contact: jgxian@xxxxxxxxxx huangchunxing@xxxxxxxxxx
Regards.
Jia Gongxian
Huawei Technologies Co.,Ltd.
Tel: 86 755 28976415
FAX: 86 755 28977095
Web: http://www.huawei.com
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