John: On FR-4 (& similar) materials, the change in height (coefficient of thermal expansion in Z direction) should dominate your trace impedance changes over temperature. Some of these materials are optimized for less change, but in general, it's a concern if your design is very impedance sensitive (like filters, matching networks, resonant networks, etc). It's pretty straightforward to run impedance calculations for your traces at your temperature extremes to see if there is any concern. A lot of designs are fairly tolerant of impedance changes & often these over temp impedance changes are on the order of the tolerances offered by PCB fab houses. I don't have any info on dielectric constant over temperature (I've actually found it hard to locate), but I would expect this variation to be much more of a 2nd order effect. You can experiment with it and see how much variation matters. Regards. -----Original Message----- From: si-list-bounce@xxxxxxxxxxxxx [mailto:si-list-bounce@xxxxxxxxxxxxx] On Behalf Of steve weir Sent: Friday, May 19, 2006 7:42 AM To: jhill@xxxxxxxxxx; si-list@xxxxxxxxxxxxx Subject: [SI-LIST] Re: Signal Integrity issues at -40 degrees C John, there may be some change in the loss at low temperature due to=20 crystallization of water. I would expect tanloss to increase, but do=20 not have hard data. I don't think the fast corner at low temp is the=20 killer. I think the slow corner at high temp will have the worse=20 timing margins. I would check with Isola, Nelco etc on the specifics=20 of the dielectric. Regards, Steve At 07:06 AM 5/19/2006, Hill, John wrote: >Hello, >We are starting a new design with 5 DDR2 memory busses and three >microprocessors. The design must work from -40 to +85 degrees C. I am >concerned that at low temperatures the edge rates will increase and I >don't know what will happen to the characteristic impedance of the >traces. I expect to have more issues with Signal Integrity issues at -40 >than at 25 degrees C. Is this correct? > >BTW, does anyone know the temperature coefficient of the Dielectric >Constant of various FR4 materials? > >Best regards, > >John > > >--------------------------------------- >The information in this email and attachments hereto may contain=20 >legally privileged, proprietary or confidential information that is=20 >intended for a particular recipient. If you are not the intended=20 >recipient(s), or the employee or agent responsible for delivery of=20 >this message to the intended recipient(s), you are hereby notified=20 >that any disclosure, copying, distribution, retention or use of the=20 >contents of this e-mail information is prohibited and may be=20 >unlawful. When addressed to Takata customers or vendors, any=20 >information contained in this e-mail is subject to the terms and=20 >conditions in the governing contract, if applicable. 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