[SI-LIST] Signal Integrity for PCB Designers
- From: V S <for_si2003@xxxxxxxxx>
- To: si-list@xxxxxxxxxxxxx
- Date: Thu, 19 Mar 2009 13:39:18 -0700 (PDT)
Competitively priced at $55 for new, my book has been released and is available
at amazon.
Name - "Signal Integrity for PCB Designers"
Author - Vikas Shukla
I have some copies of it that I have listed for $30 on amazon.
If you want a review copy, please email me. I have limited copies that I can
send for $15 (covers printing and shipping cost, that you can recover by
selling back to amazon)
Here are the contents. You may like to review some pages in Amazon before
buying. I hope it to help PCB Designers and Managers. You may like to hand over
this book to PCB Designers working under you.
Table of Contents
1 Introduction.. 4
1.1 Integrity of Point to Point Signal 5
1.2 Timing Relationship between Signals. 6
1.3 Coupling of the traces. 6
1.4 Noise less Power supply. 7
1.5 Electromagnetic Radiation. 7
1.6 PCB Design for High Speed. 7
1.7 Knee Frequency. 12
1.8 Periodic Waves and Fourier Transform.. 12
1.9 Tom and Bob. 16
2 Timing Relationship between Signals. 17
2.1 Setup and Hold Time. 17
2.2 Time and Distance. 18
2.3 Adding Delay Intentionally. 20
2.4 Common Clock Vs Source Synchronous Clock Scheme. 21
2.5 Incident Clocking. 23
2.6 Implementation. 23
2.7 Length Matching examples - PCI Bus Clocks. 24
2.8 Tom and Bob. 24
2.9 Questions and Answers. 26
3 Resistor and Resistance. 27
3.1 Parasitic Inductance and Capacitance of SMD Resistors. 29
4 Capacitance and Capacitor. 30
4.1 Parallel Plate Capacitor 31
4.2 Impedance of a Capacitor 32
4.3 Capacitance in a Signal Path. 33
4.4 A Real Capacitor 33
4.5 Capacitance per unit length. 34
4.6 Capacitance Per Unit length of a Coaxial Cable. 34
4.7 Capacitance per Unit Length of a Microstrip. 35
4.8 Effective Dielectric Constant 36
4.9 Embedded Microstrip Trace. 37
4.10 Stripline Trace. 38
4.11 2D Field Solver for Calculating Capacitance. 39
4.12 Accuracy of IPC Formula with respect to the 2D Field Solver 40
4.13 Fringe Effect and Capacitance of Combination of structure. 42
4.14 Via Capacitance. 43
4.15 Questions and Answers. 44
5 Inductance. 46
5.1 Origin of Inductance. 46
5.2 Magnetic Flux. 47
5.3 Definition and Calculation of Inductance. 47
5.4 Magnetic Field Line Loops. 48
5.5 Inductance of Isolated Structure. 48
5.6 Mutual Inductance. 50
5.7 Changing Magnetic Field and Induced EMF. 51
5.8 Total Inductance. 52
5.9 Impedance of a Inductor 54
5.10 Questions and Answers. 54
6 Power Planes. 56
6.1 Need of Multilayer Board. 56
6.2 Power Plane for Impedance Requirements. 56
6.3 Power Plane for Power Supply Requirement 56
6.4 Tight Coupling and Crosstalk requirements. 57
6.5 Power Plane and Stitching Capacitors. 57
6.6 A typical 4 Layer stack up. 57
6.7 A typical 6 Layer stack up. 57
6.8 A typical 8 Layer stack up. 59
6.9 Symmetry and Board Warping. 60
6.10 Tom and Bob. 60
7 Power Supply. 62
7.1 DC Perspective. 62
7.2 Power Supply – The AC Perspective. 64
7.3 Inductance of Power Supply Wiring. 67
7.4 Minimum Impedance Requirement of an IC with IO gates switching. 68
7.5 How to achieve low impedance. 71
7.6 Series Inductance of Bypass Capacitor and need for local capacitor. 72
7.7 Find the Impedance profile of power supply. 72
7.8 Capacitance of Power-Ground Plane. 74
7.9 Tom and Bob. 75
8 Differential Signaling.. 86
8.1 Advantages of Differential Signaling. 86
8.2 Immunity from Ground Noise. 86
8.3 Power saving by use of small voltage. 87
8.4 High Data Speed Possible. 87
8.5 Immunity to Crosstalk / Electromagnetic interference. 87
8.6 Rules for Differential Signal Routing. 87
8.7 Differential Impedance. 88
8.8 Microstrip Differential impedance. 88
8.9 Stripline Differential impedance. 89
8.10 Crosstalk in Differential Signaling. 90
8.11 HyperTransport – A case study. 90
8.12 Routing Differential Signals on PADS Router©.. 92
8.13 Differential Impedance Calculator Using HSPICE 2D Field Solver 97
8.14 Never Rely completely on automatic Design Rule tester 99
8.15 Questions and Answers. 100
9 Transmission Line. 101
9.1 When is Transmission Line essential 101
9.2 Properties of Transmission Lines. 102
9.3 Capacitance and Inductance Per Unit length of the Transmission Lines. 102
9.4 Propagation Delay. 103
9.5 Characteristic Impedance. 104
9.6 Impedance Calculator for Microstrip. 105
9.7 Impedance Calculator for Stripline. 109
9.8 A Comparison of the IPC Calculator, Wadell Formula and 2D Field Solver 111
9.9 Impedance Calculations and Verification from within PADS. 112
9.10 Impedance Calculations and Verification from within Allegro. 117
9.11 The Return Path on a Transmission Line. 123
9.12 Impedance between power Planes. 126
9.13 Reflections from Capacitive discontinuity. 127
9.14 Effect of Incident Signal Rise time. 128
9.15 Effect of the Capacitance Value on reflection. 129
9.16 Effect of Impedance on Reflection. 131
9.17 Compensating small Inductive or Capacitive discontinuity. 132
9.18 Calculating the length of the thin trace. 135
9.19 Thin Traces at breakout region. 140
9.20 The reflection Coefficient 141
9.21 Input Acceptance voltage. 142
9.22 The Source and Load impedance. 143
9.23 Source Termination. 144
9.24 End Termination. 145
9.25 Reflection from Capacitive Loads. 145
9.26 Transmission Line – An intuitive approach. 145
9.27 Losses in Transmission Lines. 146
9.28 Resistive Losses. 146
9.29 Estimation of Resistive loss for High Frequency Signals. 146
9.30 The Power ratios in dB.. 148
9.31 Expression of Power in Absolute Unit - dBm.. 149
9.32 Power gain in nepers. 150
9.33 Power Ratio in dB in terms of voltage ratio. 151
9.34 Expression of Voltage in Absolute Unit – dBmV.. 151
9.35 Expression of Voltage in Absolute Unit – dBμV.. 151
9.36 Skin Effect 152
9.37 Skin Depth. 153
9.38 Effect of Surface Roughness on Signal Loss. 154
9.39 Dielectric Losses. 154
9.40 Radiation and Induction Losses. 155
9.41 Questions and Answers. 155
10 Simulation using Hspice. 157
10.1 Reflected Wave Simulation. 159
10.2 Effect of Source Impedance. 160
10.3 Effect of Capacitive discontinuity. 162
10.4 Parameter in hspice. 163
10.5 Parameter sweep. 164
10.6 A 2D Field Solver using HSPICE.. 165
10.7 Inductance of a trace – an interesting rule of thumb. 171
10.8 Power Plane Inductance. 173
11 Crosstalk. 177
11.1 Inductive Coupling or Crosstalk. 177
11.2 How to avoid Inductive Crosstalk. 177
11.3 Capacitive Coupling or Crosstalk. 177
11.4 How to avoid capacitive Coupling. 178
11.5 Directionality of Crosstalk. 178
11.6 Near End Cross talk. 179
11.7 Effect of Trace separation on NEXT signal amplitude. 180
11.8 Effect of separation from Power Planes. 185
11.9 Microstrip Vs Stripline. 187
11.10 Far End Cross Talk. 189
11.11 Variation with rise time. 191
11.12 Variation with length. 192
11.13 A formula for the Far End Cross Talk Ratio. 193
11.14 Stripline and FEXT. 194
11.15 Reducing FEXT. 194
11.16 Guard Traces. 194
11.17 Practical Considerations for routing Guard Traces. 196
11.18 Questions and Answers. 197
12 Characterization of High Speed Bus. 200
12.1 Correlating Simulation Result with Characterization Results. 200
12.2 Characterizing voltage margin. 201
12.3 Characterizing frequency margin. 201
12.4 Oscilloscope. 202
12.5 Time Domain Reflectometer 205
12.6 Jitter 206
13 Designing for EMI Compliance. 209
13.1 An Approximation of Electric Field from A Current Loop Antenna. 212
13.2 What Causes EMI. 213
13.2.1 Cables. 214
13.2.2 Field induced in cables. 214
13.2.3 Clock Oscillators. 215
13.2.4 Mismatched Transmission Line. 215
13.2.5 Long Traces. 215
13.3 How to Reduce EMI. 215
13.3.1 Match the Transmission Line and Termination. 215
13.3.2 Use Short Clock Lengths where possible. 215
13.3.3 Use Differential Signaling. 215
13.3.4 Use Higher value of Series Resistor 216
13.3.5 Use Stripline over Microstrip for Critical Nets. 217
13.3.6 Board level Shielding. 217
13.3.7 Use Lower Voltage Swing. 217
13.3.8 Do not route Critical Signals near edges. 218
13.3.9 Use of Metallic Shields or Enclosures. 218
13.3.10 Shield Conductive Coating. 218
13.3.11 Use of Spread Spectrum Oscillators. 219
13.4 Conducted Emission. 220
13.5 Doing your own EMI analysis. 220
13.6 Question and Answers. 224
14 Signal Integrity Tips. 225
14.1 Tips for Integrity of Point to Point Signal 225
14.2 Tips for Cross talk Reduction. 226
14.3 Tips for Power Supply Noise Reduction. 227
14.4 Tips for EMI Reductions. 227
15 Shielding.. 229
15.1 Reflection. 230
15.2 Absorption loss. 232
15.3 Effect of Apertures. 234
16 Miscellaneous SI Topics. 236
16.1 Pre-emphasis. 236
16.2 Cable Twisting. 236
16.3 Package Model 237
16.4 Models and Modeling. 239
16.5 Right Angle PCB Bend. 241
16.6 Via. 243
16.7 Insertion of Guard Band to reduce cross talk. 243
16.8 Differential Pairs – coupling tight or not 244
16.9 Magic Capacitors. 245
16.10 PCI Bus. 246
16.11 Using Blind Vias in BGA based PCB Design. 248
16.12 BGA, Blind via and Via in Pad. 249
16.13 Consideration for Mixed PADs with and without Vias. 250
16.14 Blind Via and aspect ratio. 250
16.15 Relation between BGA pitch and pad size. 250
17 Questions and Answers. 252
18 References. 262
19 Index
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