Job Title [https://xapps9.xilinx.com/OA_HTML/cabo/images/swan/t.gif] Signal Integrity Technical Marketing Engineer* Location [https://xapps9.xilinx.com/OA_HTML/cabo/images/swan/t.gif] San Jose, CA, US Organization Name [https://xapps9.xilinx.com/OA_HTML/cabo/images/swan/t.gif] Technical Marketing Detailed Description [https://xapps9.xilinx.com/OA_HTML/cabo/images/swan/t.gif] Applicant will develop marketing requirements which address system performance in focused functional areas such as (1) advanced package design including stacked silicon interconnect, (2) highly programmable parallel IO electrical specifications, and (3) signal integrity and power integrity specifications of Xilinx's leading edge next generation productions. Applicant will validate signal integrity and power integrity solutions covering critical elements in advanced FPGA systems, including IC/TSV device, package, and system level printed circuit board interface. Applicant will utilize techniques in EM (Electro-Magnetics), circuit model generation, simulation, and validation for correlating hardware measurements versus pre/post-layout simulation. Create Application notes/White Papers that demonstrate Xilinx's solutions in the area of packaging, IO electrical, and SI/PI. Educate and train Field Applications Engineers on the use and unique benefits of these solutions. Applicant should work closely with the field to analyze and solve customer problems. Preparation of customer ready presentations and other marketing collateral to explain technical details of these solutions and competitive analysis of other vendors' products. Applicant will support critical sales opportunities as a pre-sales applications engineer. * 8+years of relevant professional experience/education in high speed digital designs, modeling and hardware characterization * BS/EECS required; * Familiarity with (1) power aware IBISv5.1 behavioral IO models, (2) EM extraction tools/platforms such as Ansys HFSS, Cadence PowerSI/Speed2000/XcitePI, (3) transient-convolution simulations using Synopsys Hspice and Agilent ADS, (4) S-parameter based simulations using Agilent ADS, and (5) writing scripts using Matlab/Python. * Thorough understanding of S-parameter modeling methodology, power Integrity principles, good simulation/debugging insights, physical scaling/dimension implications to EM behavior of silicon circuits, transmission paths/media, discrete/passive components, and integration of silicon/package/board structures. * Clear understanding of frequency domain versus time domain interactions and passivity, causality, and reciprocity. Further emphasis on large-dimension feedback mechanisms among circuit components such as driver and decoupling strategy on silicon, package, and board. Clear understanding of power distribution network design and optimization techniques. Cost conscious design principle and experience. * Requires excellent written and verbal communications skills. This email and any attachments are intended for the sole use of the named recipient(s) and contain(s) confidential information that may be proprietary, privileged or copyrighted under applicable law. If you are not the intended recipient, do not read, copy, or forward this email message or any attachments. Delete this email message and any attachments immediately. ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List forum is accessible at: http://tech.groups.yahoo.com/group/si-list List archives are viewable at: //www.freelists.org/archives/si-list Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu