[SI-LIST] Return path and C/S Impedance
- From: Sudheer B S <sudheer@xxxxxxxxxxxx>
- To: si-list@xxxxxxxxxxxxx
- Date: Mon, 04 Aug 2003 11:56:38 -0500
Hi All
I have one quection about return paths for the signals on few routed
layers
The layer stackup is designed for Controlled impedance of 50 Ohms
(1.6mm thickness)
Present stackup Proposed Stackup
TOP TOP
GND GND
SIGv SIGv
SIGh Thermal1
PWR Thermal2
BOT SIGh
PWR
BOT
( Distance between SIGv and SIGh remains same in the proposed layer
stackup )
As per the thermal analysis inputs Two thermal layers has to be added to
dessipate the heat ( meant only for Thermal via's)
If I introduce the two layers between SIGv and SIGh ( Thermal
layers not connected Electrically to maintain
the same C/S Impedance of the routed signals in SIGv and SIGh ) ,
does this have any adverse effects on the signals return path and
Impedance routed in SIGv and SIGh ?
where these Thermal layers can be connected to ? , the chasis ? if
so then it will be connected electrically
Is this a better idea to preserve the C/S Impedance of few signals ?
Any inputs to imrpove this configuration will be of great help
to me :-)
Regards
SUDHEER
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