[SI-LIST] Re: Package SI vs. PCB SI...thanks to Maxwell

  • From: "Ing. Giancarlo Guida" <gianguida@xxxxxxxx>
  • To: "Haller, Robert" <rhaller@xxxxxxxxxxxxx>
  • Date: Tue, 14 Feb 2006 18:59:46 +0100

Bob, I agree with you.

PDS and packages and others does play a significant role
in SI/EMC.

As we try, more and more, to "put" in a PCB signals with "Big bandwith"
we should be ready to take in to account effects that we neglected in 
the past.

But we are lucky..:-)))
thanks to J.C: Maxwell we have a set of equations that
perfectly describe all the effetcs we are interested....

question is: when we will have PCs and software good enough...
to simulate all the effects all together:-)))))?

Giancarlo

Haller, Robert ha scritto:
> Hassan, Giancarlo,
>  IMHO a hybrid SI process is required to handle the complexities of many
> of today's high speed PCB's. Complex accurate and complete I/O and
> interconnect models are required for high speed links, but do not ignore
> packages, power distribution or medium and slow speed networks. Murphy
> is always out there and whatever you fail to consider (analyze
> adequately) will come back to bite you.
>
> Regards,
> Bob 
>
> Robert Haller
> Enterasys Networks
> Core Routing - Hardware
> Phone: 978-684-1340 
>
> -----Original Message-----
> From: si-list-bounce@xxxxxxxxxxxxx [mailto:si-list-bounce@xxxxxxxxxxxxx]
> On Behalf Of Ing. Giancarlo Guida
> Sent: Tuesday, February 14, 2006 11:48 AM
> To: hassan@xxxxxxxx
> Cc: si-list@xxxxxxxxxxxxx
> Subject: [SI-LIST] Re: Package SI vs PCB SI
>
> Hi Hassan,
> to my opinion there are  at least 2 good reason that explain your
> statement.
>
> SI simulation accuracy depends on 2 factor:
> 1) accuracy of the model for the interconections
> 2) accuracy of the model fo the I/O Buffer
>
> it is quite clear that when the data-rates become critical it is 
> necessary to use a 3D full wave approach in the
> interconnect models
>
> I think that tools like the ones you mention does not have such 3D 
> solver because they are
> dedicated to post-layout analysis of the entire PCB and the usage of an 
> heavy 3D solver would be beyond their application area.
>
> May be a similar argument could be used to explain the need to use spice
>
> model for the I/o buffer instead of the ibis model...but I am not an 
> expert in this area.
>
> Regards
>
> Giancarlo
>
>
> Hassan O. Ali ha scritto:
>   
>> Scott,
>>
>> Thanks for this excellent response.
>>
>> I have a question for you SI folks: 
>>
>> Am I right to observe that as the data-rates increase beyond 5Gbps,
>>     
> there is an 
>   
>> increasing loss of faith on the previously popular board-level SI
>>     
> tools such as 
>   
>> SpecctraQuest (now Allegro PCB SI), XTK, Hyperlynx, ICX, etc. in favor
>>     
> of HSPICE used 
>   
>> with field-solver-s-parameter-based inteconnect models?
>>
>> I was personally surprised to see a notable absence of a focus on such
>>     
> board-level tools 
>   
>> in the just ended DesignCon 2006. What does this all mean? Is
>>     
> Darwinism (survival of the 
>   
>> fittest) at play here?
>>
>> I'd appreciate your responses.
>>
>> Best regards.
>>
>> Hassan.
>>
>>
>>
>> On Feb 14, Scott McMorrow <scott@xxxxxxxxxxxxx> wrote:
>>   
>>     
>>> Prasad
>>> The theory is the same,whether you are dealing with packages, system
>>>       
> in 
>   
>>> package, MCM or PCB.  However, the details will change quite a bit.
>>>       
> PCB 
>   
>>> SI tools tend to assume that all routing is orthogonal, or aligned at
>>>       
>
>   
>>> increments of 45 degrees.  This makes sense, since orthogonal and 45 
>>> degree diagonal routing are extremely efficient with respect to space
>>>       
>
>   
>>> utilization.  An assumption is therefore made by the PCB trace 
>>> extraction tools that two traces are either parallel, or they are
>>>       
> not.  
>   
>>> If they are parallel (as defined by parallelism on the 8 compass 
>>> directions) then coupling is calculated.  If not, no coupling is 
>>> calculated.  For all other traces, with non-45 degree angles, or 
>>> different angles, they are assumed to be uncoupled and independent.
>>>       
> As 
>   
>>> I said, for PCB designs, this is often a reasonable assumption.  But
>>>       
> for 
>   
>>> aggressive PCB design where odd-angle routing is used for maximum
>>>       
> trace 
>   
>>> density between parts, and for MCMs and packages, where routing often
>>>       
>
>   
>>> radiates from a die in the center out to the balls, PCB-type trace 
>>> modeling software can be woefully inadequate.  That's where you start
>>>       
>
>   
>>> getting into the problem of non-uniform coupled transmission lines
>>>       
> and 
>   
>>> imperfect planes with large numbers of perforations. 
>>>
>>> Current density on package power and ground planes is much higher
>>>       
> than 
>   
>>> that on PCB planes, causing additional SSO, SSN problems that are not
>>>       
> as 
>   
>>> likely to impact signals on a PCB.  As a result, analysis of package
>>>       
> SI 
>   
>>> usually involves a combination of 3D solvers, and complete simulation
>>>       
> of 
>   
>>> the package signal, power, ground and return paths.  Books like Eric 
>>> Bogatin's give you all the basic information that you need.  You can 
>>> then expand your knowledge with Brian Young's book, Digital Signal 
>>> Integrity, which has a very good discussion of partial inductance and
>>>       
>
>   
>>> package measurements, Clayton Paul's book, Analysis of Multiconductor
>>>       
>
>   
>>> Transmission Lines, which is still the fundamental theoretical book
>>>       
> on 
>   
>>> TEM transmission line modeling, and Luc Martens book, High-Frequency 
>>> Characterization of Electronic Packaging, which gives a good overview
>>>       
> of 
>   
>>> modern package characterization techniques.
>>>
>>> At the IC level, SI becomes even more difficult.  There are no ground
>>>       
>
>   
>>> planes, only power and ground meshes.  Multiple modes of propagation
>>>       
> can 
>   
>>> exist, including slow-wave mode, where the electric and magnetic
>>>       
> fields 
>   
>>> decouple, due to the semiconductor properties of the dielectric,
>>>       
> rapidly 
>   
>>> increasing propagation delays, and causing significant dispersion.
>>>       
> Ed 
>   
>>> Sayre, III, on this list, has some background in this area.  I am
>>>       
> sure 
>   
>>> there are others lurking on this list that also have significant 
>>> experience in on-chip SI.
>>>
>>> Best regards and happy learning,
>>>
>>> Scott
>>>
>>>
>>> Scott McMorrow
>>> Teraspeed Consulting Group LLC
>>> 121 North River Drive
>>> Narragansett, RI 02882
>>> (401) 284-1827 Business
>>> (401) 284-1840 Fax
>>>
>>> <a 
>>>     
>>>       
> href='http://www.teraspeed.com</a>'>http://www.teraspeed.com'>http://www
> .teraspeed.com</a
>   
>>   
>>     
>>> Teraspeed(r) is the registered service mark of
>>> Teraspeed Consulting Group LLC
>>>
>>>
>>>
>>> prasadsa wrote:
>>>     
>>>       
>>>> Thanks for all your mails. Many of these books talk about refers to
>>>>         
> SI on 
>   
>>>> Boards. But i am looking in particularly for books on IC-Package if
>>>>         
> any or 
>   
>>>> does the same theory (books) holds good on IC-Package also.
>>>>
>>>> Regards,
>>>> Prasad S A
>>>>
>>>> ----- Original Message ----- 
>>>> From: "Coe, Stephen" <scoe@xxxxxxxxxxxxx>
>>>> To: <qazi@xxxxxxxxxx>; <si-list@xxxxxxxxxxxxx>
>>>> Sent: Tuesday, February 14, 2006 2:54 AM
>>>> Subject: [SI-LIST] Re: Good book
>>>>
>>>>
>>>>   
>>>>       
>>>>         
>>>>> Let me add my 2 cents :=20
>>>>>
>>>>> "High-Speed Circuit Board Signal Integrity"=20
>>>>>
>>>>> by Stephen Thierauf
>>>>>
>>>>> Regards,
>>>>>
>>>>> Steve
>>>>>
>>>>> -----Original Message-----
>>>>> From: si-list-bounce@xxxxxxxxxxxxx
>>>>>           
> [mailto:si-list-bounce@xxxxxxxxxxxxx]
>   
>>>>> On Behalf Of Qazi Arif Iqbal
>>>>> Sent: Monday, February 06, 2006 6:37 PM
>>>>> To: si-list@xxxxxxxxxxxxx
>>>>> Subject: [SI-LIST] Re: Good book
>>>>>
>>>>> Eric Bogatin's "Signal Integrity Simplified" is another excellent
>>>>>           
> book.
>   
>>>>> Qazi=20
>>>>>
>>>>> -----Original Message-----
>>>>> From: si-list-bounce@xxxxxxxxxxxxx
>>>>>           
> [mailto:si-list-bounce@xxxxxxxxxxxxx]
>   
>>>>> On Behalf Of Doug Martens
>>>>> Sent: Sunday, February 05, 2006 8:25 PM
>>>>> To: akhilesh.chandra@xxxxxx; prasadsa@xxxxxxxxxx
>>>>> Cc: si-list@xxxxxxxxxxxxx
>>>>> Subject: [SI-LIST] Re: Good book
>>>>>
>>>>> Black Magic is written by Howard Johnston and it is a good book.
>>>>> Another good book is from Lee Ritchey called "Right the first Time:
>>>>>           
> a
>   
>>>>> practical handbook on high speed PCB and System design"
>>>>>
>>>>> -----Original Message-----
>>>>> From: si-list-bounce@xxxxxxxxxxxxx
>>>>>           
> [mailto:si-list-bounce@xxxxxxxxxxxxx]
>   
>>>>> On Behalf Of Akhilesh CHANDRA
>>>>> Sent: February 5, 2006 9:19 PM
>>>>> To: prasadsa@xxxxxxxxxx
>>>>> Cc: si-list@xxxxxxxxxxxxx
>>>>> Subject: [SI-LIST] Re: Good book
>>>>>
>>>>> Hello Prasad,
>>>>>
>>>>>  In my view for signel integrity best book is "BLACK MAGIC" I =
>>>>> forgot=3D20
>>>>> the name of the writer. I will serch it on net and inform you soon.
>>>>>
>>>>> Regards
>>>>> Akhilesh
>>>>>
>>>>> prasadsa wrote:
>>>>>
>>>>>     
>>>>>         
>>>>>           
>>>>>> Hi,
>>>>>> Can you please suggest me a good book for IC-Packaging / SIP
>>>>>>             
> Technology
>   
>>>>>>       
>>>>>> & SI book on the same subject.
>>>>>>
>>>>>> Thanks in advance
>>>>>> Prasad
>>>>>>
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  • » [SI-LIST] Re: Package SI vs. PCB SI...thanks to Maxwell