[SI-LIST] Latest Technical Tidbit article on using IC shields as a troubleshooting method
- From: Doug Smith <doug@xxxxxxxxxx>
- To: Si-List <si-list@xxxxxxxxxxxxx>, emc-pstc <emc-pstc@xxxxxxxx>
- Date: Sun, 08 May 2011 21:26:07 -0700
Hi Everyone,
My latest Technical Tidbit article is up!
Abstract: An IC package "shield" made from copper foil tape can be used for
troubleshooting a number of problems including ground noise and some ESD
problems. Construction of such a shield and its applications are discussed.
Discussion: Figure 1 shows an example of a "shield" made of copper foil
tape[1] which is connected to the ground pins of an IC package with short
wires. Sometimes the copper foil tape is not necessarily acting as a shield
but instead to improve the grounding under the IC such as in single and two
layer boards. Used either as a shield or to improve grounding, such a
structure can act as a troubleshooting aid for a number of PCB problems.
Examples of such problems include:
The address is: http://emcesd.com/tt2011/tt050411.htm[2]
Doug
-- ------------------------------------------------------- ___ _ Doug Smith
\/ ) P.O. Box 1457 ========= Los Gatos, CA 95031-1457 _ / \ / \ _ TEL/FAX:
408-356-4186/358-3799 / /\ \ ] / /\ \ Mobile: 408-858-4528 | q-----( ) | o |
Email: doug@xxxxxxxxxx[3] \ _ / ] \ _ / Website: http://www.dsmith.org[4]
-------------------------------------------------------
--- Links ---
1 http://emcesd.com/tt090100.htm
2 http://emcesd.com/tt2011/tt050411.htm
3 mailto:doug@xxxxxxxxxx
4 http://www.dsmith.org
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