Hi! In one of my application I want to route microstrip trace of length 250mil from a SMA (end launch) to a surface mount component. In my stackup the GND plane is 5 mil away from TOP. I used a microstrip calculator and if I keep the width 8 mil I can achieve 50ohms on 1oz Cu. So, the question I have is for an end launch SMA with 50ohm trace to a surface mount component I should not see much capacitive dip except a slight at the pad of pin to trace connection. ANy suggestion to improve this? Also, on the vertical mount any suggestion for the transistion from pin to trace. Here also I have microstrip trace. ANy inputs will be helpful. Also, I have done the usual things like removal of unused pads, increasing antipad etc. Thanks Bob __________________________________________________ Do You Yahoo!? Yahoo! Tax Center - online filing with TurboTax http://taxes.yahoo.com/ ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List archives are viewable at: //www.freelists.org/archives/si-list or at our remote archives: http://groups.yahoo.com/group/si-list/messages Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu