[SI-LIST] Impact of finite and irregular ground planes on stripline bandwidth
- From: Walter Kreiger <reiki@xxxxxxxxxxx>
- To: si-list@xxxxxxxxxxxxx
- Date: Sat, 06 Sep 2003 11:59:48 -0400
SI-List,
Has anyone done or know a reference to the solution of the stripline
thru the via (plated thru hole) "field" of a BGA(that can be shared)?
I'm concerned with the periodic array of circular holes in the reference
(ground) planes of the stripline and the associated "via fence-like"
structure and their effects on the impedance and S-parameters. I'm
looking at some very fast edge speeds requiring greater than 5GHZ -3dB
bandwidths and am hoping to get away from blind vias construction (i.e.
multiple lamination cycles). I've read of results for a "grid" ground
plane in multilayer ceramic substrates, but never a "swiss cheese"
ground plane in a printed circuit board.
Thanks,
Walt Kreiger
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